Part Details for CY7C1460KV25-200BZI by Cypress Semiconductor
Overview of CY7C1460KV25-200BZI by Cypress Semiconductor
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for CY7C1460KV25-200BZI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
09AK1627
|
Newark | Zbt Sram, 1Mx36, Cmos, Pbga165 |Cypress Infineon Technologies CY7C1460KV25-200BZI Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$63.9300 / $74.1400 | Buy Now |
|
DISTI #
2832-CY7C1460KV25-200BZI-ND
|
DigiKey | IC SRAM 36MBIT PARALLEL 165FBGA Min Qty: 10 Lead time: 1 Weeks Container: Tray MARKETPLACE PRODUCT |
661 In Stock |
|
$87.1900 | Buy Now |
|
|
Onlinecomponents.com |
14 Partner Stock |
|
$59.0600 / $185.0200 | Buy Now | |
|
|
Flip Electronics | Stock, ship today | 661 |
|
$65.3900 | RFQ |
Part Details for CY7C1460KV25-200BZI
CY7C1460KV25-200BZI CAD Models
CY7C1460KV25-200BZI Part Data Attributes
|
|
CY7C1460KV25-200BZI
Cypress Semiconductor
Buy Now
Datasheet
|
Compare Parts:
CY7C1460KV25-200BZI
Cypress Semiconductor
ZBT SRAM, 1MX36, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165
|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Package Description | FBGA-165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX36 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 2.625 V | |
| Supply Voltage-Min (Vsup) | 2.375 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 15 mm |