Datasheets
CY7C1470BV25-200BZXI by:

ZBT SRAM, 2MX36, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

Part Details for CY7C1470BV25-200BZXI by Cypress Semiconductor

Overview of CY7C1470BV25-200BZXI by Cypress Semiconductor

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Price & Stock for CY7C1470BV25-200BZXI

Part # Distributor Description Stock Price Buy
DISTI # 98M0601
Newark Sync Srams/Tray |Cypress Infineon Technologies CY7C1470BV25-200BZXI Min Qty: 105 Package Multiple: 1 Date Code: 0 Container: Bulk 0
Buy Now
DISTI # 2156-CY7C1470BV25-200BZXI-ND
DigiKey IC SRAM 72MBIT PARALLEL 165FBGA Min Qty: 2 Container: Bulk MARKETPLACE PRODUCT 40
In Stock
  • 2 $157.6200
$157.6200 Buy Now
Rochester Electronics ZBT SRAM, 2MX36, 3ns PBGA165 RoHS: Compliant Status: Active Min Qty: 1 40
  • 1 $159.1300
  • 25 $155.9500
  • 100 $149.5900
  • 500 $143.2200
  • 1,000 $135.2600
$135.2600 / $159.1300 Buy Now
Flip Electronics Stock, ship today 1038
  • 1 $65.4700
$65.4700 RFQ

Part Details for CY7C1470BV25-200BZXI

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CY7C1470BV25-200BZXI Part Data Attributes

CY7C1470BV25-200BZXI Cypress Semiconductor
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CY7C1470BV25-200BZXI Cypress Semiconductor ZBT SRAM, 2MX36, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 3 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 17 mm
Memory Density 75497472 bit
Memory IC Type ZBT SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Voltage-Min 2.38 V
Supply Current-Max 0.45 mA
Supply Voltage-Max (Vsup) 2.625 V
Supply Voltage-Min (Vsup) 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 15 mm

Alternate Parts for CY7C1470BV25-200BZXI

This table gives cross-reference parts and alternative options found for CY7C1470BV25-200BZXI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1470BV25-200BZXI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C1470BV25-200BZXI ZBT SRAM, 2MX36, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Infineon Technologies AG CY7C1470BV25-200BZXI vs CY7C1470BV25-200BZXI
CY7C1470BV25-200BZI ZBT SRAM, 2MX36, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 Cypress Semiconductor CY7C1470BV25-200BZXI vs CY7C1470BV25-200BZI
CY7C1470BV25-200BZXC ZBT SRAM, 2MX36, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor CY7C1470BV25-200BZXI vs CY7C1470BV25-200BZXC
CY7C1470BV25-200BZC ZBT SRAM, 2MX36, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 Cypress Semiconductor CY7C1470BV25-200BZXI vs CY7C1470BV25-200BZC
Part Number Description Manufacturer Compare
GS8644V36GE-133IT Cache SRAM, 2MX36, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 GSI Technology CY7C1470BV25-200BZXI vs GS8644V36GE-133IT
GS8641ZV36GE-300 ZBT SRAM, 2MX36, 5.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 GSI Technology CY7C1470BV25-200BZXI vs GS8641ZV36GE-300
CY7C1481V33-133BZI Cache SRAM, 2MX36, 6.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 Cypress Semiconductor CY7C1470BV25-200BZXI vs CY7C1481V33-133BZI
GS8642V36GE-300 Cache SRAM, 2MX36, 5.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 GSI Technology CY7C1470BV25-200BZXI vs GS8642V36GE-300
GS8644Z36E-133IV ZBT SRAM, 2MX36, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1470BV25-200BZXI vs GS8644Z36E-133IV
CY7C1471BV25-133AXI ZBT SRAM, 2MX36, 6.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 Cypress Semiconductor CY7C1470BV25-200BZXI vs CY7C1471BV25-133AXI
CY7C1484V33-250BZC Cache SRAM, 2MX36, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 Cypress Semiconductor CY7C1470BV25-200BZXI vs CY7C1484V33-250BZC
GS8640ZV36T-167 ZBT SRAM, 2MX36, 8ns, CMOS, PQFP100, TQFP-100 GSI Technology CY7C1470BV25-200BZXI vs GS8640ZV36T-167
GS8645Z36T-200IT ZBT SRAM, 2MX36, 7.5ns, CMOS, PQFP100, TQFP-100 GSI Technology CY7C1470BV25-200BZXI vs GS8645Z36T-200IT
GS8640ZV36GT-250I ZBT SRAM, 2MX36, 6.5ns, CMOS, PQFP100, LEAD FREE, TQFP-100 GSI Technology CY7C1470BV25-200BZXI vs GS8640ZV36GT-250I

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