Part Details for CY7C1515KV18-333BZXC by Infineon Technologies AG
Overview of CY7C1515KV18-333BZXC by Infineon Technologies AG
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C1515KV18-333BZXC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-CY7C1515KV18-333BZXC-ND
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DigiKey | IC SRAM 72MBIT PARALLEL 165FBGA Min Qty: 2 Lead time: 11 Weeks Container: Bulk MARKETPLACE PRODUCT |
163 In Stock |
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$157.5900 | Buy Now |
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DISTI #
CY7C1515KV18-333BZXC-ND
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DigiKey | IC SRAM 72MBIT PARALLEL 165FBGA Min Qty: 2 Lead time: 11 Weeks Container: Tray | Temporarily Out of Stock |
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$140.4663 | Buy Now |
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DISTI #
727-CY7C1515KV1833C
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Mouser Electronics | SRAM 72MB (2Mx36) 1.8v 333MHz QDR II SRAM RoHS: Compliant | 0 |
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$136.3800 | Order Now |
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Future Electronics | CY7C1515KV18 Series 72 Mb (2 M x 36) 333 MHz QDR-II 4-Word Burst SRAM - FBGA-165 RoHS: Compliant pbFree: Yes Min Qty: 1360 Package Multiple: 136 Lead time: 11 Weeks Container: Tray | 0Tray |
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$133.7100 | Buy Now |
Part Details for CY7C1515KV18-333BZXC
CY7C1515KV18-333BZXC CAD Models
CY7C1515KV18-333BZXC Part Data Attributes
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CY7C1515KV18-333BZXC
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1515KV18-333BZXC
Infineon Technologies AG
QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | |
| Reach Compliance Code | compliant | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 333 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.85 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 13 mm |
Alternate Parts for CY7C1515KV18-333BZXC
This table gives cross-reference parts and alternative options found for CY7C1515KV18-333BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1515KV18-333BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IS61QDB42M36A-333M3L | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | CY7C1515KV18-333BZXC vs IS61QDB42M36A-333M3L |
| GS8662D36BGD-333T | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1515KV18-333BZXC vs GS8662D36BGD-333T |
| IS61QDB42M36A-333M3 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | CY7C1515KV18-333BZXC vs IS61QDB42M36A-333M3 |
| GS8672D36BE-333T | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1515KV18-333BZXC vs GS8672D36BE-333T |
| GS8662D36E-333 | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1515KV18-333BZXC vs GS8662D36E-333 |
| IS61QDB42M36A-333B3 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, TFBGA-165 | Integrated Silicon Solution Inc | CY7C1515KV18-333BZXC vs IS61QDB42M36A-333B3 |
| GS8662D36BD-333 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1515KV18-333BZXC vs GS8662D36BD-333 |
| IS61QDB42M36A-333B3L | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, LEAD FREE, TFBGA-165 | Integrated Silicon Solution Inc | CY7C1515KV18-333BZXC vs IS61QDB42M36A-333B3L |
| GS8662D36GE-333T | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1515KV18-333BZXC vs GS8662D36GE-333T |
| GS8662D36BGD-333 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1515KV18-333BZXC vs GS8662D36BGD-333 |