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Memory / SRAMs / CY7C1525V18-200BZXC
Datasheets
CY7C1525V18-200BZXC by: Cypress Semiconductor

QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

Part Details for CY7C1525V18-200BZXC by Cypress Semiconductor

Overview of CY7C1525V18-200BZXC by Cypress Semiconductor

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Price & Stock for CY7C1525V18-200BZXC

Part # Distributor Description Stock Price Buy
Rochester Electronics QDR SRAM, 8MX9, 0.45ns PBGA165 RoHS: Compliant Status: Obsolete Min Qty: 1 49
  • 1 $130.6600
  • 25 $128.0500
  • 100 $122.8200
  • 500 $117.6000
  • 1,000 $111.0600
$111.0600 / $130.6600 Buy Now

Part Details for CY7C1525V18-200BZXC

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CY7C1525V18-200BZXC Part Data Attributes

Parametric Data
CY7C1525V18-200BZXC Cypress Semiconductor
Buy Now Datasheet
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CY7C1525V18-200BZXC Cypress Semiconductor QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Pin Count 165
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 17 mm
Memory Density 75497472 bit
Memory IC Type QDR SRAM
Memory Width 9
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 8MX9
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Voltage-Min 1.7 V
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 15 mm

Alternate Parts for CY7C1525V18-200BZXC

This table gives cross-reference parts and alternative options found for CY7C1525V18-200BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1525V18-200BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C1525V18-200BZI QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C1525V18-200BZXC vs CY7C1525V18-200BZI
UPD44645092F5-E50-FQ1 QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165 NEC Electronics Group CY7C1525V18-200BZXC vs UPD44645092F5-E50-FQ1
CY7C1525V18-167BZXI QDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor CY7C1525V18-200BZXC vs CY7C1525V18-167BZXI
CY7C1525V18-167BZI QDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C1525V18-200BZXC vs CY7C1525V18-167BZI
CY7C1525V18-200BZXI QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor CY7C1525V18-200BZXC vs CY7C1525V18-200BZXI
UPD44645092F5-E50-FQ1-A QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 NEC Electronics Group CY7C1525V18-200BZXC vs UPD44645092F5-E50-FQ1-A
CY7C1525V18-167BZC QDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C1525V18-200BZXC vs CY7C1525V18-167BZC
Part Number Description Manufacturer Compare
GS8662D09BD-300T QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1525V18-200BZXC vs GS8662D09BD-300T
GS8662D09BGD-200T Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C1525V18-200BZXC vs GS8662D09BGD-200T
GS8662QT10BD-300 QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1525V18-200BZXC vs GS8662QT10BD-300
GS8662R09E-250 DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1MM PITCH, FPBGA-165 GSI Technology CY7C1525V18-200BZXC vs GS8662R09E-250
CY7C2576KV18-500BZI QDR SRAM, 8MX9, 0.33ns, CMOS, PBGA165, 15 X 13 MM, 1.4 MM HEIGHT, FBGA-165 Cypress Semiconductor CY7C1525V18-200BZXC vs CY7C2576KV18-500BZI
CY7C1529AV18-200BZI DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C1525V18-200BZXC vs CY7C1529AV18-200BZI
CY7C1529JV18-300BZXI DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor CY7C1525V18-200BZXC vs CY7C1529JV18-300BZXI
GS8662S09BGD-400T Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, BGA-165 GSI Technology CY7C1525V18-200BZXC vs GS8662S09BGD-400T
UPD44645094F5-E37-FQ1-A QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 NEC Electronics Group CY7C1525V18-200BZXC vs UPD44645094F5-E37-FQ1-A
GS8662S09E-333I DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, MO-216CAB-1, FPBGA-165 GSI Technology CY7C1525V18-200BZXC vs GS8662S09E-333I

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