Part Details for CY7C1618KV18-300BZXC by Infineon Technologies AG
Overview of CY7C1618KV18-300BZXC by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Price & Stock for CY7C1618KV18-300BZXC
Part # | Distributor | Description | Stock | Price | Buy | |
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Future Electronics | RoHS: Compliant pbFree: No Min Qty: 525 Package Multiple: 525 Lead time: 11 Weeks | 0 |
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$237.3300 | Buy Now |
DISTI #
SP005660743
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EBV Elektronik | (Alt: SP005660743) RoHS: Compliant Min Qty: 525 Package Multiple: 525 Lead time: 12 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for CY7C1618KV18-300BZXC
CY7C1618KV18-300BZXC CAD Models
CY7C1618KV18-300BZXC Part Data Attributes
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CY7C1618KV18-300BZXC
Infineon Technologies AG
Buy Now
Datasheet
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CY7C1618KV18-300BZXC
Infineon Technologies AG
DDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, FBGA-165
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | FBGA-165 | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | Infineon | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 300 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Memory Density | 150994944 bit | |
Memory IC Type | DDR SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8MX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 0.39 A | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.61 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15 mm |