Part Details for CY7C1618KV18-333BZXC by Infineon Technologies AG
Overview of CY7C1618KV18-333BZXC by Infineon Technologies AG
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Price & Stock for CY7C1618KV18-333BZXC
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
2832-CY7C1618KV18-333BZXC-ND
|
DigiKey | IC SRAM 144MBIT PAR 165FBGA Min Qty: 5 Lead time: 11 Weeks Container: Tray MARKETPLACE PRODUCT |
268 In Stock |
|
$238.5900 | Buy Now |
DISTI #
CY7C1618KV18-333BZXC-ND
|
DigiKey | IC SRAM 144MBIT PAR 165FBGA Min Qty: 5 Lead time: 11 Weeks Container: Tray | Temporarily Out of Stock |
|
$263.9890 | Buy Now |
DISTI #
CY7C1618KV18-333BZ
|
Avnet Americas | SRAM Chip Sync Single 1.8V 144M-Bit 8M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1618KV18-333BZ) RoHS: Compliant Min Qty: 3 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 268 Partner Stock |
|
$221.8856 / $268.4100 | Buy Now |
DISTI #
CY7C1618KV18-333BZ
|
Avnet Americas | SRAM Chip Sync Single 1.8V 144M-Bit 8M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1618KV18-333BZ) RoHS: Compliant Min Qty: 525 Package Multiple: 105 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
DISTI #
727-7C1618KV1333BZXC
|
Mouser Electronics | SRAM 144Mb 1.8V 333Mhz 8M x 18 DDR II SRAM RoHS: Compliant | 0 |
|
$289.0200 | Order Now |
|
Future Electronics | RoHS: Compliant pbFree: No Min Qty: 525 Package Multiple: 525 Lead time: 11 Weeks | 0 |
|
$256.3000 | Buy Now |
Part Details for CY7C1618KV18-333BZXC
CY7C1618KV18-333BZXC CAD Models
CY7C1618KV18-333BZXC Part Data Attributes
|
CY7C1618KV18-333BZXC
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
CY7C1618KV18-333BZXC
Infineon Technologies AG
DDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, FBGA-165
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | FBGA-165 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 2 Days | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 333 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Memory Density | 150994944 bit | |
Memory IC Type | DDR SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8MX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 0.41 A | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.65 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15 mm |