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Memory / SRAMs / CY7C2263KV18-550BZXI
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CY7C2263KV18-550BZXI by:

QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

Part Details for CY7C2263KV18-550BZXI by Infineon Technologies AG

Overview of CY7C2263KV18-550BZXI by Infineon Technologies AG

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Price & Stock for CY7C2263KV18-550BZXI

Part # Distributor Description Stock Price Buy
DISTI # 2832-CY7C2263KV18-550BZXI-ND
DigiKey IC SRAM 36MBIT PAR 165FBGA Min Qty: 1 Lead time: 11 Weeks Container: Tray MARKETPLACE PRODUCT 2843
In Stock
  • 10 $97.6800
$97.6800 Buy Now
DISTI # 2015-CY7C2263KV18-550BZXI-ND
DigiKey IC SRAM 36MBIT PAR 165FBGA Min Qty: 1 Lead time: 11 Weeks Container: Tray 56
In Stock
  • 1 $43.6600
$43.6600 Buy Now
DISTI # CY7C2263KV18-550BZXI-ND
DigiKey IC SRAM 36MBIT PAR 165FBGA Min Qty: 1 Lead time: 11 Weeks Container: Tray Temporarily Out of Stock
  • 680 $108.0727
$108.0727 Buy Now
DISTI # CY7C2263KV18-550BZ
Avnet Americas SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C2263KV18-550BZ) RoHS: Compliant Min Qty: 680 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray 0
  • 680 $130.1070
$130.1070 Buy Now
DISTI # 727-7C2263KV550BZXI
Mouser Electronics SRAM 36MB (2Mx18) 1.8v 550MHz QDR II SRAM RoHS: Compliant 144
  • 1 $144.8700
  • 10 $126.2200
  • 25 $125.8800
  • 50 $122.5000
$122.5000 / $144.8700 Buy Now
Future Electronics   RoHS: Compliant pbFree: No Min Qty: 680 Package Multiple: 680 Container: Tray 0
Tray
  • 680 $104.9300
$104.9300 Buy Now
DISTI # CY7C2263KV18-550BZ
Avnet Americas SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C2263KV18-550BZ) RoHS: Compliant Min Qty: 680 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray 0
  • 680 $130.1070
$130.1070 Buy Now
Ameya Holding Limited IC SRAM 36MBIT 550MHZ 165FBGA 72
RFQ

Part Details for CY7C2263KV18-550BZXI

CY7C2263KV18-550BZXI CAD Models

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CY7C2263KV18-550BZXI Part Data Attributes:

Parametric Data
CY7C2263KV18-550BZXI Infineon Technologies AG
Buy Now Datasheet
Compare Parts:
CY7C2263KV18-550BZXI Infineon Technologies AG QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Reach Compliance Code compliant
Factory Lead Time 11 Weeks
Samacsys Manufacturer Infineon
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 550 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 37748736 bit
Memory IC Type QDR SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.36 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.85 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm

Alternate Parts for CY7C2263KV18-550BZXI

This table gives cross-reference parts and alternative options found for CY7C2263KV18-550BZXI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C2263KV18-550BZXI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C2270KV18-550BZXC DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Infineon Technologies AG CY7C2263KV18-550BZXI vs CY7C2270KV18-550BZXC
GS8161E36DGT-150V Cache SRAM, 512KX36, 7.5ns, CMOS, PQFP100, TQFP-100 GSI Technology CY7C2263KV18-550BZXI vs GS8161E36DGT-150V
GS8161E36DD-150I Cache SRAM, 512KX36, 7.5ns, CMOS, PBGA165, FPBGA-165 GSI Technology CY7C2263KV18-550BZXI vs GS8161E36DD-150I
GS8161E36DD-250 Cache SRAM, 512KX36, 5.5ns, CMOS, PBGA165, FPBGA-165 GSI Technology CY7C2263KV18-550BZXI vs GS8161E36DD-250
GS8161E36DGD-250V Cache SRAM, 512KX36, 5.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C2263KV18-550BZXI vs GS8161E36DGD-250V
GS8161E36DGT-200 Cache SRAM, 512KX36, 4.2ns, CMOS, ROHS COMPLIANT, TQFP-100 GSI Technology CY7C2263KV18-550BZXI vs GS8161E36DGT-200
CY7C1150KV18-400BZXI DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, FBGA-165 Infineon Technologies AG CY7C2263KV18-550BZXI vs CY7C1150KV18-400BZXI
GS8161E36DD-150V Cache SRAM, 512KX36, 7.5ns, CMOS, PBGA165, FPBGA-165 GSI Technology CY7C2263KV18-550BZXI vs GS8161E36DD-150V
CY7C1420KV18-300BZXC DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Infineon Technologies AG CY7C2263KV18-550BZXI vs CY7C1420KV18-300BZXC
GS8162Z18DD-250V ZBT SRAM, 1MX18, 5.5ns, CMOS, PBGA165, FPBGA-165 GSI Technology CY7C2263KV18-550BZXI vs GS8162Z18DD-250V

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