There are no models available for this part yet.
Overview of CY7C2263XV18-600BZXC by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for CY7C2263XV18-600BZXC by Cypress Semiconductor
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
05W7485
|
Newark | Sync Srams/Tray |Cypress Infineon Technologies CY7C2263XV18-600BZXC RoHS: Not Compliant Min Qty: 680 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now | ||
DISTI #
2156-CY7C2263XV18-600BZXC-ND
|
DigiKey | IC SRAM 36MBIT PAR 165FBGA Min Qty: 3 Container: Bulk MARKETPLACE PRODUCT |
156 In Stock |
|
$110.9100 | Buy Now | |
Rochester Electronics | CY7C2263XV18 - QDR SRAM, 2MX18, 0.45ns PBGA165 ' RoHS: Compliant Status: Active Min Qty: 1 | 25 |
|
$95.1800 / $111.9700 | Buy Now |
CAD Models for CY7C2263XV18-600BZXC by Cypress Semiconductor
Part Data Attributes for CY7C2263XV18-600BZXC by Cypress Semiconductor
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code
|
BGA
|
Package Description
|
FBGA-165
|
Pin Count
|
165
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.A
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
0.45 ns
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
Clock Frequency-Max (fCLK)
|
600 MHz
|
I/O Type
|
SEPARATE
|
JESD-30 Code
|
R-PBGA-B165
|
JESD-609 Code
|
e1
|
Length
|
15 mm
|
Memory Density
|
37748736 bit
|
Memory IC Type
|
QDR SRAM
|
Memory Width
|
18
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
165
|
Number of Words
|
2097152 words
|
Number of Words Code
|
2000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
2MX18
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Equivalence Code
|
BGA165,11X15,40
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.4 mm
|
Standby Current-Max
|
1.1 A
|
Standby Voltage-Min
|
1.7 V
|
Supply Current-Max
|
1.1 mA
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
13 mm
|