Part Details for CY7C2563XV18-600BZXC by Infineon Technologies AG
Overview of CY7C2563XV18-600BZXC by Infineon Technologies AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (2 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Healthcare
Medical Imaging
Robotics and Drones
Price & Stock for CY7C2563XV18-600BZXC
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CY7C2563XV18-600BZXC-ND
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DigiKey | IC SRAM 72MBIT PAR 165FBGA Min Qty: 136 Lead time: 11 Weeks Container: Tray | Temporarily Out of Stock |
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$413.8025 | Buy Now |
DISTI #
CY7C2563XV18-600BZ
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C2563XV18-600BZ) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$498.1700 | Buy Now |
DISTI #
727-2563XV18-600BZXC
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Mouser Electronics | SRAM 72MB (4Mx18) 1.8v 600MHz QDR II SRAM RoHS: Compliant | 0 |
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$401.7500 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 136 Package Multiple: 136 Container: Tray | 0Tray |
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$401.7500 | Buy Now |
DISTI #
CY7C2563XV18-600BZ
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C2563XV18-600BZ) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$498.1700 | Buy Now |
Part Details for CY7C2563XV18-600BZXC
CY7C2563XV18-600BZXC CAD Models
CY7C2563XV18-600BZXC Part Data Attributes:
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CY7C2563XV18-600BZXC
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C2563XV18-600BZXC
Infineon Technologies AG
QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | FBGA-165 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 11 Weeks | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 600 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 2MX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 1.1 A | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 1.1 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 13 mm |
Alternate Parts for CY7C2563XV18-600BZXC
This table gives cross-reference parts and alternative options found for CY7C2563XV18-600BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C2563XV18-600BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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CY7C2563XV18-600BZC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | Infineon Technologies AG | CY7C2563XV18-600BZXC vs CY7C2563XV18-600BZC |
CY7C2563XV18-600BZXC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | CY7C2563XV18-600BZXC vs CY7C2563XV18-600BZXC |