Part Details for CY7C25702KV18-500BZXC by Infineon Technologies AG
Overview of CY7C25702KV18-500BZXC by Infineon Technologies AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C25702KV18-500BZXC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-CY7C25702KV18-500BZXC-ND
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DigiKey | IC SRAM 72MBIT PAR 165FBGA Min Qty: 1 Lead time: 11 Weeks Container: Bulk MARKETPLACE PRODUCT |
170 In Stock |
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$304.7900 | Buy Now |
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DISTI #
CY7C25702KV18-500BZXC-ND
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DigiKey | IC SRAM 72MBIT PAR 165FBGA Min Qty: 1 Lead time: 11 Weeks Container: Tray | Limited Supply - Call |
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$271.6754 | Buy Now |
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DISTI #
CY7C25702KV18-500B
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Avnet Americas | SRAM Chip Sync Single 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA - Trays (Alt: CY7C25702KV18-500B) RoHS: Compliant Min Qty: 2 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 170 Partner Stock |
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$249.1300 / $307.7200 | Buy Now |
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DISTI #
CY7C25702KV18-500B
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Avnet Americas | SRAM Chip Sync Single 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA - Trays (Alt: CY7C25702KV18-500B) RoHS: Compliant Min Qty: 680 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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Future Electronics | CY7C25702 72 Mb (2M x 36) 0.45ns 1.8 V Single Sync SRAM - FBGA-165 RoHS: Compliant pbFree: Yes Min Qty: 680 Package Multiple: 136 Lead time: 11 Weeks Container: Tray | 0Tray |
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$266.3500 | Buy Now |
Part Details for CY7C25702KV18-500BZXC
CY7C25702KV18-500BZXC CAD Models
CY7C25702KV18-500BZXC Part Data Attributes
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CY7C25702KV18-500BZXC
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C25702KV18-500BZXC
Infineon Technologies AG
DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 MM X 13 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | 15 MM X 13 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 11 Weeks | |
| Access Time-Max | 0.45 ns | |
| Clock Frequency-Max (fCLK) | 500 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.36 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.89 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 13 mm |
Alternate Parts for CY7C25702KV18-500BZXC
This table gives cross-reference parts and alternative options found for CY7C25702KV18-500BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C25702KV18-500BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IS61DDPB22M36A1-500M3 | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.20 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | CY7C25702KV18-500BZXC vs IS61DDPB22M36A1-500M3 |
| CY7C2570KV18-500BZC | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | CY7C25702KV18-500BZXC vs CY7C2570KV18-500BZC |
| IS61DDPB22M36A2-500M3L | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.20 MM HEIGHT, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | CY7C25702KV18-500BZXC vs IS61DDPB22M36A2-500M3L |
| IS61DDPB22M36A2-500M3 | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.20 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | CY7C25702KV18-500BZXC vs IS61DDPB22M36A2-500M3 |
| CY7C25702KV18-500BZXC | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 MM X 13 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C25702KV18-500BZXC vs CY7C25702KV18-500BZXC |