Memory
CY7C2570KV18-400BZC
Description: DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165

Overview of CY7C2570KV18-400BZC by Cypress Semiconductor

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Price & Stock for CY7C2570KV18-400BZC by Cypress Semiconductor

Part # Manufacturer Description Stock Price Buy
Rochester Electronics DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165 ' RoHS: Not Compliant Status: Obsolete Min Qty: 1 116
  • 1 $286.1400
  • 25 $280.4200
  • 100 $268.9700
  • 500 $257.5200
  • 1,000 $243.2200
$243.2200 / $286.1400 Buy Now

CAD Models for CY7C2570KV18-400BZC by Cypress Semiconductor
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Part Data Attributes for CY7C2570KV18-400BZC by Cypress Semiconductor

CY7C2570KV18-400BZC
Cypress Semiconductor
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Pin Count
165
Reach Compliance Code
not_compliant
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
400 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B165
Length
15 mm
Memory Density
75497472 bit
Memory IC Type
DDR SRAM
Memory Width
36
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
165
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
2MX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
1.4 mm
Standby Current-Max
0.34 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.75 mA
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
13 mm
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  1. CY7C2570KV18-400BZC
    Cypress Semiconductor
    DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
    VS

Alternate Parts for CY7C2570KV18-400BZC

This table gives cross-reference parts and alternative options found for CY7C2570KV18-400BZC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C2570KV18-400BZC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
CY7C2570KV18-400BZXC DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor CY7C2570KV18-400BZC vs CY7C2570KV18-400BZXC
CY7C2570KV18-400BZI DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C2570KV18-400BZC vs CY7C2570KV18-400BZI
CY7C2570KV18-400BZXI DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor CY7C2570KV18-400BZC vs CY7C2570KV18-400BZXI
Part Number Description Manufacturer Compare
IS61QDP2B42M36A1-333M3 QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc CY7C2570KV18-400BZC vs IS61QDP2B42M36A1-333M3
GS8662Q37BD-357T DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C2570KV18-400BZC vs GS8662Q37BD-357T
GS8662Q36BGD-357 QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C2570KV18-400BZC vs GS8662Q36BGD-357
GS8662D36BGD-400I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C2570KV18-400BZC vs GS8662D36BGD-400I
CY7C1545KV18-400BZC QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C2570KV18-400BZC vs CY7C1545KV18-400BZC
GS8662D36BD-400I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C2570KV18-400BZC vs GS8662D36BD-400I
IS61QDP2B42M36A1-450M3L QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc CY7C2570KV18-400BZC vs IS61QDP2B42M36A1-450M3L
IS61QDP2B42M36A2-400M3 QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc CY7C2570KV18-400BZC vs IS61QDP2B42M36A2-400M3
CY7C1565KV18-550BZXC QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Infineon Technologies AG CY7C2570KV18-400BZC vs CY7C1565KV18-550BZXC
IS61DDPB22M36A-400M3LI DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc CY7C2570KV18-400BZC vs IS61DDPB22M36A-400M3LI

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