Part Details for CY7C2642KV18-333BZXC by Infineon Technologies AG
Overview of CY7C2642KV18-333BZXC by Infineon Technologies AG
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Computing and Data Storage
Agriculture Technology
Price & Stock for CY7C2642KV18-333BZXC
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
2832-CY7C2642KV18-333BZXC-ND
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DigiKey | IC SRAM 144MBIT PAR 165FBGA Min Qty: 2 Lead time: 11 Weeks Container: Tray MARKETPLACE PRODUCT |
60 In Stock |
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$360.0000 | Buy Now |
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DISTI #
CY7C2642KV18-333BZXC-ND
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DigiKey | IC SRAM 144MBIT PAR 165FBGA Min Qty: 2 Lead time: 11 Weeks Container: Tray | Temporarily Out of Stock |
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$281.5505 | Buy Now |
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DISTI #
CY7C2642KV18-333BZ
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Avnet Americas | SRAM Chip Sync Dual 1.8V 144M-Bit 8M x 18-Bit 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C2642KV18-333BZ) RoHS: Compliant Min Qty: 2 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 148 Partner Stock |
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$318.9100 | Buy Now |
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DISTI #
CY7C2642KV18-333BZ
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Avnet Americas | SRAM Chip Sync Dual 1.8V 144M-Bit 8M x 18-Bit 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C2642KV18-333BZ) RoHS: Compliant Min Qty: 2 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 60 Partner Stock |
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$334.8000 / $405.0000 | Buy Now |
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DISTI #
727-7C2642K18333BZXC
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Mouser Electronics | SRAM 144Mb, 1.8V, 333Mhz QDR II+ SRAM RoHS: Compliant | 0 |
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$281.9400 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: No Min Qty: 210 Package Multiple: 210 Lead time: 11 Weeks | 0 |
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$273.3500 | Buy Now |
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Rochester Electronics | CY7C2642KV18 - QDR SRAM, 8MX18, 0.45ns PBGA165 RoHS: Compliant Status: Active Min Qty: 1 | Call for Availability |
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$271.0700 / $318.9100 | Buy Now |
Part Details for CY7C2642KV18-333BZXC
CY7C2642KV18-333BZXC CAD Models
CY7C2642KV18-333BZXC Part Data Attributes
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CY7C2642KV18-333BZXC
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C2642KV18-333BZXC
Infineon Technologies AG
QDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | Infineon | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 333 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Memory Density | 150994944 bit | |
| Memory IC Type | QDR II PLUS SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 8MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Voltage-Min | 1.7 V | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 15 mm |