Part Details for CY7C4121KV13-667FCXC by Cypress Semiconductor
Overview of CY7C4121KV13-667FCXC by Cypress Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for CY7C4121KV13-667FCXC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
49X8422
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Newark | Sram, 144Mbit, 667Mhz, Fcbga-361, Memory Size:144Mbit, Sram Memory Configuration:8M X 18Bit, Supply Voltage Range:1.26V To 1.34V, Memory Case Style:Fbga, No. Of Pins:361Pins, Access Time:50Ns, Operating Temperature Min:0°C Rohs Compliant: Yes |Cypress Infineon Technologies CY7C4121KV13-667FCXC Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Buy Now | |
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Rochester Electronics | QDR SRAM, 8MX18 PBGA361 ' RoHS: Compliant Status: Active Min Qty: 1 | 50 |
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$216.6800 / $254.9200 | Buy Now |
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Chip1Cloud | IC SRAM 144MBIT PAR 361FCBGA | 3010 |
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RFQ |
Part Details for CY7C4121KV13-667FCXC
CY7C4121KV13-667FCXC CAD Models
CY7C4121KV13-667FCXC Part Data Attributes:
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CY7C4121KV13-667FCXC
Cypress Semiconductor
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Datasheet
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CY7C4121KV13-667FCXC
Cypress Semiconductor
QDR SRAM, 8MX18, CMOS, PBGA361, 21 X 21 MM, 2.515 MM HEIGHT, LEAD FREE, FCBGA-361
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Package Description | 21 X 21 MM, 2.515 MM HEIGHT, LEAD FREE, FCBGA-361 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| JESD-30 Code | S-PBGA-B361 | |
| JESD-609 Code | e1 | |
| Length | 21 mm | |
| Memory Density | 150994944 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 361 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 8MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Parallel/Serial | PARALLEL | |
| Seated Height-Max | 2.765 mm | |
| Supply Voltage-Max (Vsup) | 1.34 V | |
| Supply Voltage-Min (Vsup) | 1.26 V | |
| Supply Voltage-Nom (Vsup) | 1.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 21 mm |