There are no models available for this part yet.
Overview of CY7C4122KV13-106FCXC by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 5 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for CY7C4122KV13-106FCXC by Infineon Technologies AG
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
CY7C4122KV13-106FCXC-ND
|
DigiKey | IC SRAM 144MBIT PAR 361FCBGA Min Qty: 600 Lead time: 11 Weeks Container: Tray | Temporarily Out of Stock |
|
$263.5255 | Buy Now | |
DISTI #
CY7C4122KV13-106FC
|
Avnet Americas | SRAM Chip Sync Single 1.3V 144M-Bit 8M x 18 361-Pin FCBGA - Trays (Alt: CY7C4122KV13-106FC) RoHS: Compliant Min Qty: 600 Package Multiple: 60 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | ||
DISTI #
727-7C4122V13106FCXC
|
Mouser Electronics | SRAM 144Mb, 1.3V, 106Mhz 8Mx18 QDR-IV HP SRAM RoHS: Compliant | 0 |
|
$263.2900 | Order Now | |
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 600 Package Multiple: 600 Lead time: 11 Weeks | 0 |
|
$255.8500 | Buy Now | ||
DISTI #
SP005652127
|
EBV Elektronik | SRAM Chip Sync Single 1.3V 144M-Bit 8M x 18 361-Pin FCBGA (Alt: SP005652127) RoHS: Compliant Min Qty: 600 Package Multiple: 600 Lead time: 12 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
CAD Models for CY7C4122KV13-106FCXC by Infineon Technologies AG
Part Data Attributes for CY7C4122KV13-106FCXC by Infineon Technologies AG
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
|
Package Description
|
FCBGA-361
|
Reach Compliance Code
|
compliant
|
Factory Lead Time
|
11 Weeks
|
Samacsys Manufacturer
|
Infineon
|
JESD-30 Code
|
S-PBGA-B361
|
JESD-609 Code
|
e1
|
Length
|
21 mm
|
Memory Density
|
150994944 bit
|
Memory IC Type
|
QDR SRAM
|
Memory Width
|
18
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
361
|
Number of Words
|
8388608 words
|
Number of Words Code
|
8000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
8MX18
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
HBGA
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, HEAT SINK/SLUG
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Seated Height-Max
|
2.765 mm
|
Supply Voltage-Max (Vsup)
|
1.34 V
|
Supply Voltage-Min (Vsup)
|
1.26 V
|
Supply Voltage-Nom (Vsup)
|
1.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
21 mm
|
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