Part Details for CYD09S72V18-200BBXI by Rochester Electronics LLC
Overview of CYD09S72V18-200BBXI by Rochester Electronics LLC
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Part Details for CYD09S72V18-200BBXI
CYD09S72V18-200BBXI CAD Models
CYD09S72V18-200BBXI Part Data Attributes
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CYD09S72V18-200BBXI
Rochester Electronics LLC
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CYD09S72V18-200BBXI
Rochester Electronics LLC
128KX72 DUAL-PORT SRAM, 3.3ns, PBGA484, 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484 | |
| Pin Count | 484 | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 3.3 ns | |
| JESD-30 Code | S-PBGA-B484 | |
| Length | 23 mm | |
| Memory Density | 9437184 bit | |
| Memory IC Type | DUAL-PORT SRAM | |
| Memory Width | 72 | |
| Number of Functions | 1 | |
| Number of Terminals | 484 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX72 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 2.16 mm | |
| Supply Voltage-Max (Vsup) | 1.58 V | |
| Supply Voltage-Min (Vsup) | 1.42 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm |