Part Details for CYD09S72V18-200BGXI by Rochester Electronics LLC
Overview of CYD09S72V18-200BGXI by Rochester Electronics LLC
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Part Details for CYD09S72V18-200BGXI
CYD09S72V18-200BGXI CAD Models
CYD09S72V18-200BGXI Part Data Attributes
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CYD09S72V18-200BGXI
Rochester Electronics LLC
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Datasheet
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CYD09S72V18-200BGXI
Rochester Electronics LLC
128KX72 DUAL-PORT SRAM, 3.3ns, PBGA484, 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Part Package Code | BGA | |
Package Description | 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484 | |
Pin Count | 484 | |
Reach Compliance Code | unknown | |
Access Time-Max | 3.3 ns | |
Additional Feature | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | |
JESD-30 Code | S-PBGA-B484 | |
Length | 23 mm | |
Memory Density | 9437184 bit | |
Memory IC Type | DUAL-PORT SRAM | |
Memory Width | 72 | |
Moisture Sensitivity Level | NOT SPECIFIED | |
Number of Functions | 1 | |
Number of Terminals | 484 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128KX72 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | COMMERCIAL | |
Seated Height-Max | 2.16 mm | |
Supply Voltage-Max (Vsup) | 1.58 V | |
Supply Voltage-Min (Vsup) | 1.42 V | |
Supply Voltage-Nom (Vsup) | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | NOT SPECIFIED | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 23 mm |