Part Details for DF36902GFHV by Renesas Electronics Corporation
Overview of DF36902GFHV by Renesas Electronics Corporation
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Applications
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Consumer Electronics
Education and Research
Security and Surveillance
Aerospace and Defense
Healthcare
Robotics and Drones
Part Details for DF36902GFHV
DF36902GFHV CAD Models
DF36902GFHV Part Data Attributes:
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DF36902GFHV
Renesas Electronics Corporation
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DF36902GFHV
Renesas Electronics Corporation
Microcontrollers with a 32-bit H8/300H CPU core (Non Promotion), , /
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | QFP | |
Package Description | QFP, QFP32,.35SQ,32 | |
Pin Count | 32 | |
Manufacturer Package Code | PLQP0032GC | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Renesas Electronics | |
Bit Size | 16 | |
CPU Family | H8/300H | |
JESD-30 Code | S-PQFP-G32 | |
Number of Terminals | 32 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | -20 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP32,.35SQ,32 | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
RAM (bytes) | 1536 | |
ROM (words) | 8192 | |
ROM Programmability | FLASH | |
Speed | 12 MHz | |
Supply Current-Max | 18 mA | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.8 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |