Part Details for DSPIC33FJ32GS606T-E/PTV02 by Microchip Technology Inc
Overview of DSPIC33FJ32GS606T-E/PTV02 by Microchip Technology Inc
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Price & Stock for DSPIC33FJ32GS606T-E/PTV02
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NAC | RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 0 |
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Part Details for DSPIC33FJ32GS606T-E/PTV02
DSPIC33FJ32GS606T-E/PTV02 CAD Models
DSPIC33FJ32GS606T-E/PTV02 Part Data Attributes
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DSPIC33FJ32GS606T-E/PTV02
Microchip Technology Inc
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DSPIC33FJ32GS606T-E/PTV02
Microchip Technology Inc
16-Bit Size, 0-Ext Bit, 40MHz, CMOS, PQFP64
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Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | TQFP-64 | |
Reach Compliance Code | compliant | |
Address Bus Width | ||
Barrel Shifter | YES | |
Bit Size | 16 | |
Boundary Scan | YES | |
Clock Frequency-Max | 40 MHz | |
External Data Bus Width | ||
Format | FIXED POINT | |
Integrated Cache | NO | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-PQFP-G64 | |
Length | 10 mm | |
Low Power Mode | YES | |
Number of DMA Channels | 4 | |
Number of External Interrupts | 5 | |
Number of Serial I/Os | 2 | |
Number of Terminals | 64 | |
Number of Timers | 8 | |
On Chip Data RAM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFQFP | |
Package Equivalence Code | TQFP64,.47SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
RAM (words) | 4096 | |
ROM Programmability | FLASH | |
Screening Level | AEC-Q100; TS 16949 | |
Seated Height-Max | 1.2 mm | |
Supply Current-Max | 170 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 10 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, CONTROLLER |