Part Details for EFM32GG890F512G-E-BGA112R by Silicon Laboratories Inc
Overview of EFM32GG890F512G-E-BGA112R by Silicon Laboratories Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Price & Stock for EFM32GG890F512G-E-BGA112R
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
EFM32GG890F512G-E-BGA112R-ND
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DigiKey | IC MCU 32BIT 512KB FLASH 112BGA Min Qty: 1000 Lead time: 12 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$9.2150 | Buy Now |
DISTI #
634-32GG890F512-E-T
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Mouser Electronics | ARM Microcontrollers - MCU 512k Flash, 128k RAM, 8x36 LCD, AES RoHS: Compliant | 0 |
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$9.2100 | Order Now |
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Symmetry Electronics | Min Qty: 1 | 0 |
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$9.2500 | Buy Now |
Part Details for EFM32GG890F512G-E-BGA112R
EFM32GG890F512G-E-BGA112R CAD Models
EFM32GG890F512G-E-BGA112R Part Data Attributes
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EFM32GG890F512G-E-BGA112R
Silicon Laboratories Inc
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Datasheet
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EFM32GG890F512G-E-BGA112R
Silicon Laboratories Inc
RISC Microcontroller, CMOS
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | SILICON LABORATORIES INC | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | 28 | |
Boundary Scan | NO | |
CPU Family | EFM32 | |
Clock Frequency-Max | 48 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | 16 | |
Format | FIXED POINT | |
Integrated Cache | NO | |
JESD-30 Code | S-PBGA-B112 | |
JESD-609 Code | e4 | |
Length | 10 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | 12 | |
Number of External Interrupts | 16 | |
Number of I/O Lines | 90 | |
Number of Terminals | 112 | |
Number of Timers | 4 | |
On Chip Data RAM Width | 8 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA112,11X11,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (words) | 131072 | |
ROM (words) | 524288 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.3 mm | |
Speed | 48 MHz | |
Supply Current-Max | 100 mA | |
Supply Voltage-Max | 3.8 V | |
Supply Voltage-Min | 1.98 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | NICKEL GOLD | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 10 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |