Part Details for EMD3D256M16G2-150CBS1R by Everspin Technologies
Overview of EMD3D256M16G2-150CBS1R by Everspin Technologies
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Consumer Electronics
Industrial Automation
Computing and Data Storage
Renewable Energy
Robotics and Drones
Price & Stock for EMD3D256M16G2-150CBS1R
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
819-EMD3D256M16G2-150CBS1RTR-ND
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DigiKey | IC RAM 256MBIT PAR 96BGA Min Qty: 2000 Lead time: 28 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$51.3500 | Buy Now |
DISTI #
EMD3D256M16G2-150CBS1R
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EBV Elektronik | (Alt: EMD3D256M16G2-150CBS1R) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 13 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for EMD3D256M16G2-150CBS1R
EMD3D256M16G2-150CBS1R CAD Models
EMD3D256M16G2-150CBS1R Part Data Attributes
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EMD3D256M16G2-150CBS1R
Everspin Technologies
Buy Now
Datasheet
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Compare Parts:
EMD3D256M16G2-150CBS1R
Everspin Technologies
Memory Circuit,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | EVERSPIN TECHNOLOGIES INC | |
Package Description | TFBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Date Of Intro | 2018-02-09 | |
Samacsys Manufacturer | Everspin Technologies | |
JESD-30 Code | R-PBGA-B96 | |
Length | 13 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 96 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 16MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 1.575 V | |
Supply Voltage-Min (Vsup) | 1.425 V | |
Supply Voltage-Nom (Vsup) | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 10 mm |