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EZR32HG220F64R67G-B0R by: Silicon Laboratories Inc

RISC Microcontroller,

Part Details for EZR32HG220F64R67G-B0R by Silicon Laboratories Inc

Overview of EZR32HG220F64R67G-B0R by Silicon Laboratories Inc

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Applications Consumer Electronics Internet of Things (IoT) Smart Cities

Price & Stock for EZR32HG220F64R67G-B0R

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DISTI # EZR32HG220F64R67G-B0R-ND
DigiKey IC RF TXRX+MCU 802.15.4 48VFQFN Lead time: 52 Weeks Container: Tape & Reel (TR) Limited Supply - Call
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Part Details for EZR32HG220F64R67G-B0R

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EZR32HG220F64R67G-B0R Part Data Attributes:

EZR32HG220F64R67G-B0R Silicon Laboratories Inc
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EZR32HG220F64R67G-B0R Silicon Laboratories Inc RISC Microcontroller,
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SILICON LABORATORIES INC
Reach Compliance Code compliant
HTS Code 8542.31.00.01
Has ADC YES
Address Bus Width
Bit Size 32
Boundary Scan NO
CPU Family Cortex-M0+
Clock Frequency-Max 25 MHz
DAC Channels YES
DMA Channels YES
External Data Bus Width
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-XQCC-N48
JESD-609 Code e3
Length 7 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of External Interrupts 16
Number of I/O Lines 27
Number of Serial I/Os 3
Number of Terminals 48
Number of Timers 5
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Equivalence Code LCC48,.27SQ,20
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
RAM (bytes) 8192
ROM (words) 65536
ROM Programmability FLASH
Seated Height-Max 0.9 mm
Speed 25 MHz
Supply Voltage-Max 3.8 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3 V
Surface Mount YES
Technology CMOS
Terminal Finish MATTE TIN
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

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