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Overview of FM30C256-G by Ramtron International Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
CAD Models for FM30C256-G by Ramtron International Corporation
Part Data Attributes for FM30C256-G by Ramtron International Corporation
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|
---|---|
Part Life Cycle Code
|
Obsolete
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Ihs Manufacturer
|
RAMTRON INTERNATIONAL CORP
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Part Package Code
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SOIC
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Package Description
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SOP,
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Pin Count
|
20
|
Reach Compliance Code
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unknown
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ECCN Code
|
EAR99
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HTS Code
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8542.32.00.71
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JESD-30 Code
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R-PDSO-G20
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Length
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12.8 mm
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Memory Density
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262144 bit
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Memory IC Type
|
MEMORY CIRCUIT
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Memory Width
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8
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Number of Functions
|
1
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Number of Terminals
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20
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Number of Words
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32768 words
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Number of Words Code
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32000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-40 °C
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Organization
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32KX8
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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SOP
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Package Shape
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RECTANGULAR
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Package Style
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SMALL OUTLINE
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Seated Height-Max
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2.65 mm
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Supply Voltage-Max (Vsup)
|
5.5 V
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Supply Voltage-Min (Vsup)
|
4.5 V
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Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
|
YES
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Technology
|
CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Form
|
GULL WING
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Terminal Pitch
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1.27 mm
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Terminal Position
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DUAL
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Width
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7.5 mm
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