FS32R372SBK0MMMT
NXP Semiconductors
Description: RISC Microprocessor

Overview of FS32R372SBK0MMMT by NXP Semiconductors

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
  • Distributor Offerings: ( 6 listings )
  • Number of FFF Equivalents: ( 0 replacements )
  • CAD Models: ( Request Part )
  • Number of Functional Equivalents: ( 0 options )
  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )

Price & Stock for FS32R372SBK0MMMT by NXP Semiconductors

Part # Manufacturer Description Stock Price Buy
DISTI # 62AC0073
Newark 768Kb Sram, 1.3Mb Flash/ Tray Rohs Compliant: Yes |Nxp FS32R372SBK0mmT RoHS: Compliant Min Qty: 760 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 100 $34.2000
$34.2000 Buy Now
DISTI # 568-FS32R372SBK0MMMT-ND
DigiKey IC MCU 32B 1.3MB FLASH 257MAPBGA Min Qty: 760 Lead time: 20 Weeks Container: Tray Temporarily Out of Stock
  • 760 $32.6250
$32.6250 Buy Now
DISTI # FS32R372SBK0MMMT
Avnet Americas 768KB SRAM, 1.3MB FLASH - Trays (Alt: FS32R372SBK0MMMT) Min Qty: 760 Package Multiple: 760 Lead time: 12 Weeks, 0 Days Container: Tray 0
  • 760 $34.8036
$34.8036 Buy Now
DISTI # 771-FS32R372SBK0MMMT
Mouser Electronics 32-bit Microcontrollers - MCU 768KB SRAM, 1.3MB FLASH RoHS: Compliant 0
  • 760 $35.8800
$35.8800 Order Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 760 Package Multiple: 760 Lead time: 12 Weeks Container: Tray 0
Tray
  • 760 $34.8000
$34.8000 Buy Now
DISTI # FS32R372SBK0MMMT
EBV Elektronik 768KB SRAM, 1.3MB FLASH (Alt: FS32R372SBK0MMMT) RoHS: Compliant Min Qty: 152 Package Multiple: 152 Lead time: 14 Weeks, 0 Days EBV - 0
Buy Now

CAD Models for FS32R372SBK0MMMT by NXP Semiconductors
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Part Data Attributes for FS32R372SBK0MMMT by NXP Semiconductors

FS32R372SBK0MMMT
NXP Semiconductors
-
-
Rohs Code
Yes
Part Life Cycle Code
Not Recommended
Ihs Manufacturer
NXP SEMICONDUCTORS
Reach Compliance Code
compliant
Factory Lead Time
12 Weeks
Samacsys Manufacturer
NXP
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
40 MHz
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B257
Length
14 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of DMA Channels
32
Number of External Interrupts
1
Number of Terminals
257
On Chip Data RAM Width
8
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
LFBGA
Package Equivalence Code
BGA257,17X17,32
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
RAM (words)
1048576
Screening Level
ISO 26262
Seated Height-Max
1.51 mm
Speed
240 MHz
Supply Current-Max
1100 mA
Supply Voltage-Max
1.31 V
Supply Voltage-Min
1.19 V
Supply Voltage-Nom
1.25 V
Surface Mount
YES
Technology
CMOS
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
14 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
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