Part Details for FS32V234CKN1VUB by NXP Semiconductors
Overview of FS32V234CKN1VUB by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Education and Research
Audio and Video Systems
Aerospace and Defense
Communication and Networking
Price & Stock for FS32V234CKN1VUB
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
58AC6803
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Newark | S32V234 Quad-Core Arm, 1 Ghz, Security, Iso 26262 - S32V Mpus For Front/Surround View Camera, Computer Vision/ Tray Rohs Compliant: Yes |Nxp FS32V234CKN1VUB Min Qty: 450 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$64.6400 | Buy Now |
|
|
Rochester Electronics | FS32V - S32V234 quad-core Arm, 1 GHz, Security RoHS: Compliant Status: Obsolete Min Qty: 1 | 900 |
|
$68.8600 / $81.0100 | Buy Now |
Part Details for FS32V234CKN1VUB
FS32V234CKN1VUB CAD Models
FS32V234CKN1VUB Part Data Attributes:
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FS32V234CKN1VUB
NXP Semiconductors
Buy Now
Datasheet
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FS32V234CKN1VUB
NXP Semiconductors
RISC Microprocessor
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | FBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | ||
| Bit Size | 64 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 40 MHz | |
| External Data Bus Width | ||
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B621 | |
| JESD-609 Code | e2 | |
| Length | 17 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 32 | |
| Number of External Interrupts | 1 | |
| Number of Serial I/Os | ||
| Number of Terminals | 621 | |
| On Chip Data RAM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA621,25X25,25 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (words) | 4194304 | |
| Seated Height-Max | 2.44 mm | |
| Speed | 1000 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 17 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |