Part Details for FXLA2203UMX by Fairchild Semiconductor Corporation
Overview of FXLA2203UMX by Fairchild Semiconductor Corporation
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Consumer Electronics
Education and Research
Security and Surveillance
Aerospace and Defense
Healthcare
Robotics and Drones
Price & Stock for FXLA2203UMX
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-FXLA2203UMX-ND
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DigiKey | DUAL-MODE DUAL-SIM CARD LEVEL TR Min Qty: 1025 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
476137 In Stock |
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$0.2900 | Buy Now |
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Rochester Electronics | Dual-Mode Dual-SIM Card Level Translator RoHS: Compliant Status: End of Life / Last Time Buy Min Qty: 1 | 484894 |
|
$0.2514 / $0.2958 | Buy Now |
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Chip1Cloud | IC TRANSLATOR LEVEL DUAL 24UMLP | 32000 |
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RFQ |
Part Details for FXLA2203UMX
FXLA2203UMX CAD Models
FXLA2203UMX Part Data Attributes:
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FXLA2203UMX
Fairchild Semiconductor Corporation
Buy Now
Datasheet
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FXLA2203UMX
Fairchild Semiconductor Corporation
RF and Baseband Circuit, 3.40 X 2.50 MM, 0.40 MM, PLASTIC, UMLP-24
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
Part Package Code | UMLP | |
Package Description | 3.40 X 2.50 MM, 0.40 MM, PLASTIC, UMLP-24 | |
Pin Count | 24 | |
Manufacturer Package Code | 24LD,UMLP,QUAD, NON-JEDEC, 2.5 X 3.4MM BODY | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | R-XQCC-N24 | |
JESD-609 Code | e3 | |
Length | 3.4 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | VQCCN | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 0.55 mm | |
Surface Mount | YES | |
Telecom IC Type | RF AND BASEBAND CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.4 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 2.5 mm |