Part Details for GN1032W-CHIP by Semtech Corporation
Overview of GN1032W-CHIP by Semtech Corporation
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
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Price & Stock for GN1032W-CHIP
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GN1032W-CHIP-ND
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DigiKey | IC TRANSIMPEDANCE AMP Lead time: 24 Weeks Container: Tray | Temporarily Out of Stock |
|
Buy Now | |
DISTI #
GN1032W-CHIP
|
Avnet Americas | Transimpedance Amplifier 2.5Gbps 3.6kOhm 3.3V Bare DIE Waffle Pack - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: GN1032W-CHIP) Min Qty: 400 Package Multiple: 400 Lead time: 24 Weeks, 0 Days Container: Waffle Pack | 0 |
|
RFQ | |
DISTI #
GN1032W-CHIP
|
Avnet Americas | Transimpedance Amplifier 2.5Gbps 3.6kOhm 3.3V Bare DIE Waffle Pack - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: GN1032W-CHIP) Min Qty: 400 Package Multiple: 400 Lead time: 24 Weeks, 0 Days Container: Waffle Pack | 0 |
|
RFQ |