Part Details for GS81302D09E-333 by GSI Technology
Overview of GS81302D09E-333 by GSI Technology
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for GS81302D09E-333
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS81302D09E-333
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 144M-Bit 16M x 9-Bit 0.45ns 165-Pin FBGA Tray - Trays (Alt: GS81302D09E-333) RoHS: Not Compliant Min Qty: 105 Package Multiple: 105 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
|
$149.3028 / $183.8430 | Buy Now |
DISTI #
464-GS81302D09E-333
|
Mouser Electronics | SRAM RoHS: Not Compliant | 0 |
|
$166.0700 | Order Now |
DISTI #
GS81302D09E-333
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 144M-Bit 16M x 9-Bit 0.45ns 165-Pin FBGA Tray - Trays (Alt: GS81302D09E-333) RoHS: Not Compliant Min Qty: 105 Package Multiple: 105 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
|
$149.3028 / $183.8430 | Buy Now |
Part Details for GS81302D09E-333
GS81302D09E-333 CAD Models
GS81302D09E-333 Part Data Attributes:
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GS81302D09E-333
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS81302D09E-333
GSI Technology
DDR SRAM, 16MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 24 Weeks | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
JESD-30 Code | R-PBGA-B165 | |
Length | 17 mm | |
Memory Density | 150994944 bit | |
Memory IC Type | DDR SRAM | |
Memory Width | 9 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 16MX9 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.5 mm | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15 mm |
Alternate Parts for GS81302D09E-333
This table gives cross-reference parts and alternative options found for GS81302D09E-333. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS81302D09E-333, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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GS81302D09GE-333 | DDR SRAM, 16MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS81302D09E-333 vs GS81302D09GE-333 |