Part Details for GS81302D11GE-500I by GSI Technology
Overview of GS81302D11GE-500I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
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| LT3500IMSE#TRPBF | Analog Devices | Mono 2A Buck Reg Plus Lin Reg/ |
Price & Stock for GS81302D11GE-500I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
GS81302D11GE-500I
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Avnet Americas | SRAM Chip Sync Dual 1.8V 144M-Bit 16M x 9-Bit 0.45ns 165-Pin FBGA Tray - Bulk (Alt: GS81302D11GE-500I) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
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$217.6428 / $267.9930 | Buy Now |
|
DISTI #
464-GS81302D11GE500I
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Mouser Electronics | SRAM RoHS: Compliant | 0 |
|
$218.8600 / $221.0600 | Order Now |
Part Details for GS81302D11GE-500I
GS81302D11GE-500I CAD Models
GS81302D11GE-500I Part Data Attributes
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GS81302D11GE-500I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS81302D11GE-500I
GSI Technology
DDR SRAM, 16MX9, 0.37ns, CMOS, PBGA165, FPBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| Access Time-Max | 0.37 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Memory Density | 150994944 bit | |
| Memory IC Type | QDR II PLUS SRAM | |
| Memory Width | 9 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16MX9 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 15 mm |
Alternate Parts for GS81302D11GE-500I
This table gives cross-reference parts and alternative options found for GS81302D11GE-500I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS81302D11GE-500I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS81302DT19E-450 | QDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS81302D11GE-500I vs GS81302DT19E-450 |
| GS8662DT20BD-350I | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS81302D11GE-500I vs GS8662DT20BD-350I |
| GS8662S18BGD-350I | Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 | GSI Technology | GS81302D11GE-500I vs GS8662S18BGD-350I |
| GS81302D38E-350 | DDR SRAM, 4MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS81302D11GE-500I vs GS81302D38E-350 |
| GS81302DT19E-400 | QDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS81302D11GE-500I vs GS81302DT19E-400 |
| GS8662D20BGD-350I | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS81302D11GE-500I vs GS8662D20BGD-350I |
| GS81302D06E-350I | DDR SRAM, 16MX8, 0.45ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | GS81302D11GE-500I vs GS81302D06E-350I |
| GS8662D20BD-350 | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS81302D11GE-500I vs GS8662D20BD-350 |
| GS8672D19BE-333I | Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS81302D11GE-500I vs GS8672D19BE-333I |
| GS8662D19BD-300 | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS81302D11GE-500I vs GS8662D19BD-300 |