There are no models available for this part yet.
Overview of GS81302D36E-350 by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for GS81302D36E-350 by GSI Technology
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
GS81302D36E-350
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 144M-Bit 4M x 36 0.45ns 165-Pin FBGA Tray - Bulk (Alt: GS81302D36E-350) RoHS: Not Compliant Min Qty: 105 Package Multiple: 105 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$157.1820 / $193.5450 | Buy Now | |
DISTI #
464-GS81302D36E-350
|
Mouser Electronics | SRAM RoHS: Not Compliant | 0 |
|
$174.9000 | Order Now |
CAD Models for GS81302D36E-350 by GSI Technology
Part Data Attributes for GS81302D36E-350 by GSI Technology
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Not Recommended
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
Part Package Code
|
BGA
|
Package Description
|
LBGA,
|
Pin Count
|
165
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.B
|
HTS Code
|
8542.32.00.41
|
Factory Lead Time
|
24 Weeks
|
Access Time-Max
|
0.45 ns
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
JESD-30 Code
|
R-PBGA-B165
|
Length
|
17 mm
|
Memory Density
|
150994944 bit
|
Memory IC Type
|
DDR SRAM
|
Memory Width
|
36
|
Number of Functions
|
1
|
Number of Terminals
|
165
|
Number of Words
|
4194304 words
|
Number of Words Code
|
4000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
4MX36
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.5 mm
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
15 mm
|