Datasheets
GS81302D37GE-300I by: GSI Technology

DDR SRAM, 4MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

Part Details for GS81302D37GE-300I by GSI Technology

Overview of GS81302D37GE-300I by GSI Technology

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Price & Stock for GS81302D37GE-300I

Part # Distributor Description Stock Price Buy
DISTI # GS81302D37GE-300I
Avnet Americas GTEGS81302D37GE-300I - Trays (Alt: GS81302D37GE-300I) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 24 Weeks, 0 Days Container: Tray 0
  • 105 $193.5450
  • 210 $190.0260
  • 420 $180.6420
  • 630 $175.9500
  • 840 $170.0850
  • 1,050 $161.8740
  • 10,500 $157.1820
$157.1820 / $193.5450 Buy Now
DISTI # 464-GS81302D37GE300I
Mouser Electronics SRAM RoHS: Compliant 0
  • 10 $174.9000
$174.9000 Order Now
DISTI # GS81302D37GE-300I
Avnet Americas GTEGS81302D37GE-300I - Trays (Alt: GS81302D37GE-300I) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 24 Weeks, 0 Days Container: Tray 0
  • 105 $193.5450
  • 210 $190.0260
  • 420 $180.6420
  • 630 $175.9500
  • 840 $170.0850
  • 1,050 $161.8740
  • 10,500 $157.1820
$157.1820 / $193.5450 Buy Now
DISTI # GS81302D37GE-300I
Avnet Silica GTEGS81302D37GE-300I (Alt: GS81302D37GE-300I) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 9 Weeks, 0 Days Silica - 0
Buy Now

Part Details for GS81302D37GE-300I

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GS81302D37GE-300I Part Data Attributes:

GS81302D37GE-300I GSI Technology
Buy Now Datasheet
Compare Parts:
GS81302D37GE-300I GSI Technology DDR SRAM, 4MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA,
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Samacsys Manufacturer GSI TECHNOLOGY
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 17 mm
Memory Density 150994944 bit
Memory IC Type QDR II PLUS SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 4MX36
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 15 mm

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