Datasheets
GS81313HT18GK-550 by: GSI Technology

DDR SRAM, 8MX18, CMOS, PBGA260, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-260

Part Details for GS81313HT18GK-550 by GSI Technology

Overview of GS81313HT18GK-550 by GSI Technology

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Price & Stock for GS81313HT18GK-550

Part # Distributor Description Stock Price Buy
DISTI # 464-GS81313HT18GK550
Mouser Electronics SRAM RoHS: Compliant 0
  • 1 $267.0900
  • 10 $258.4000
  • 20 $255.1800
$255.1800 / $267.0900 Order Now

Part Details for GS81313HT18GK-550

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GS81313HT18GK-550 Part Data Attributes

GS81313HT18GK-550 GSI Technology
Buy Now Datasheet
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GS81313HT18GK-550 GSI Technology DDR SRAM, 8MX18, CMOS, PBGA260, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-260
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Package Description HBGA, BGA260,13X20,40
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Clock Frequency-Max (fCLK) 550 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B260
Length 22 mm
Memory Density 150994944 bit
Memory IC Type DDR SRAM
Memory Width 18
Number of Functions 1
Number of Terminals 260
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 8MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA260,13X20,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, HEAT SINK/SLUG
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 2.3 mm
Standby Voltage-Min 1.15 V
Supply Voltage-Max (Vsup) 1.35 V
Supply Voltage-Min (Vsup) 1.15 V
Supply Voltage-Nom (Vsup) 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 14 mm

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