There are no models available for this part yet.
Overview of GS81313HT18GK-550I by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
LT6550IMS#PBF | Analog Devices | 3.3V 3x & 4x Video Amps | |
LTC1550IGN#PBF | Analog Devices | L N, Switched Cap-Reg V Inv | |
LT8550IUKG#TRPBF | Analog Devices | Multiphase Buck Converter Expa |
Price & Stock for GS81313HT18GK-550I by GSI Technology
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
464-81313HT18GK550I
|
Mouser Electronics | SRAM RoHS: Compliant | 0 |
|
$279.8800 / $292.7400 | Order Now |
CAD Models for GS81313HT18GK-550I by GSI Technology
Part Data Attributes for GS81313HT18GK-550I by GSI Technology
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
Package Description
|
HBGA, BGA260,13X20,40
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.A
|
HTS Code
|
8542.32.00.41
|
Clock Frequency-Max (fCLK)
|
550 MHz
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PBGA-B260
|
Length
|
22 mm
|
Memory Density
|
150994944 bit
|
Memory IC Type
|
DDR SRAM
|
Memory Width
|
18
|
Number of Functions
|
1
|
Number of Terminals
|
260
|
Number of Words
|
8388608 words
|
Number of Words Code
|
8000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
8MX18
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
HBGA
|
Package Equivalence Code
|
BGA260,13X20,40
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, HEAT SINK/SLUG
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2.3 mm
|
Standby Voltage-Min
|
1.15 V
|
Supply Voltage-Max (Vsup)
|
1.35 V
|
Supply Voltage-Min (Vsup)
|
1.15 V
|
Supply Voltage-Nom (Vsup)
|
1.2 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Width
|
14 mm
|