Part Details for GS81313LT18GK-625I by GSI Technology
Overview of GS81313LT18GK-625I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Industrial Automation
Aerospace and Defense
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for GS81313LT18GK-625I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
GS81313LT18GK-625I
|
Avnet Americas | SRAM Chip 144M-bit 8M x 18 625MHz 260-Pin BGA - Trays (Alt: GS81313LT18GK-625I) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days Container: Tray | 0 |
|
$379.2200 / $466.9500 | Buy Now |
|
DISTI #
464-81313LT18GK625I
|
Mouser Electronics | SRAM 1.2/1.25V 8M x 18 144M RoHS: Compliant | 0 |
|
$373.5400 / $378.4900 | Order Now |
Part Details for GS81313LT18GK-625I
GS81313LT18GK-625I CAD Models
GS81313LT18GK-625I Part Data Attributes
|
|
GS81313LT18GK-625I
GSI Technology
Buy Now
Datasheet
|
Compare Parts:
GS81313LT18GK-625I
GSI Technology
DDR SRAM, 8MX18, CMOS, PBGA260, BGA-260
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Package Description | HBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 20 Weeks | |
| JESD-30 Code | R-PBGA-B260 | |
| Length | 22 mm | |
| Memory Density | 150994944 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 260 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 8MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 2.3 mm | |
| Supply Voltage-Max (Vsup) | 1.35 V | |
| Supply Voltage-Min (Vsup) | 1.15 V | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |