There are no models available for this part yet.
Overview of GS81314LD18GK-106I by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
LTC3106IUDC#PBF | Analog Devices | 300mA L V Buck-Boost Conv w/ P | |
LTC7106IDDB#TRMPBF | Analog Devices | A 7-B C DAC w/ PMBus Int | |
LTC3106IUDC#TRPBF | Analog Devices | 300mA L V Buck-Boost Conv w/ P |
Price & Stock for GS81314LD18GK-106I by GSI Technology
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
GS81314LD18GK-106I
|
Avnet Americas | SRAM Chip 144M-bit 8M x 18 1066MHz 260-Pin BGA - Trays (Alt: GS81314LD18GK-106I) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days Container: Tray | 0 |
|
$478.3800 / $589.0500 | Buy Now | |
DISTI #
464-81314LD18GK106I
|
Mouser Electronics | SRAM 1.2/1.25V 8M x 18 144M RoHS: Compliant | 0 |
|
$478.1100 | Order Now |
CAD Models for GS81314LD18GK-106I by GSI Technology
Part Data Attributes for GS81314LD18GK-106I by GSI Technology
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
Package Description
|
HBGA,
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.B
|
HTS Code
|
8542.32.00.41
|
Factory Lead Time
|
20 Weeks
|
Date Of Intro
|
2016-01-22
|
JESD-30 Code
|
R-PBGA-B260
|
Length
|
22 mm
|
Memory Density
|
150994944 bit
|
Memory IC Type
|
QDR SRAM
|
Memory Width
|
18
|
Number of Functions
|
1
|
Number of Terminals
|
260
|
Number of Words
|
8388608 words
|
Number of Words Code
|
8000000
|
Operating Mode
|
SYNCHRONOUS
|
Organization
|
8MX18
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
HBGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, HEAT SINK/SLUG
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Seated Height-Max
|
2.3 mm
|
Supply Voltage-Max (Vsup)
|
1.35 V
|
Supply Voltage-Min (Vsup)
|
1.15 V
|
Supply Voltage-Nom (Vsup)
|
1.2 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
14 mm
|