There are no models available for this part yet.
Overview of GS81314LQ19GK-800I by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| EP1800ILC-70 | Rochester Electronics LLC | Replacement for Altera part number EP1800ILC-70. Buy from authorized manufacturer Rochester Electronics. | |
| LTC7800IUDC#TRPBF | Analog Devices | L IQ , 60V, Hi Freq Sync Buck | |
| LTC7800IUDC#PBF | Analog Devices | L IQ , 60V, Hi Freq Sync Buck |
Price & Stock for GS81314LQ19GK-800I by GSI Technology
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
GS81314LQ19GK-800I
|
Avnet Americas | SRAM Chip 144M-bit 8M x 18 800MHz 260-Pin BGA - Trays (Alt: GS81314LQ19GK-800I) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days Container: Tray | 0 |
|
$491.7800 / $605.5500 | Buy Now | |
|
DISTI #
464-81314LQ19GK800I
|
Mouser Electronics | SRAM 1.2/1.25V 8M x 18 144M RoHS: Compliant | 0 |
|
$491.5700 | Order Now |
CAD Models for GS81314LQ19GK-800I by GSI Technology
Part Data Attributes for GS81314LQ19GK-800I by GSI Technology
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|
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|---|---|
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Part Life Cycle Code
|
Active
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Ihs Manufacturer
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GSI TECHNOLOGY
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Package Description
|
HBGA,
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Reach Compliance Code
|
compliant
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ECCN Code
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3A991.B.2.B
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|
HTS Code
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8542.32.00.41
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Factory Lead Time
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20 Weeks
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Date Of Intro
|
2016-03-01
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JESD-30 Code
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R-PBGA-B260
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Length
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22 mm
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Memory Density
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150994944 bit
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Memory IC Type
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DDR SRAM
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Memory Width
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18
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Number of Functions
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1
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Number of Terminals
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260
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Number of Words
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8388608 words
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Number of Words Code
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8000000
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Operating Mode
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SYNCHRONOUS
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Organization
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8MX18
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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HBGA
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, HEAT SINK/SLUG
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Parallel/Serial
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PARALLEL
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Seated Height-Max
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2.3 mm
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Supply Voltage-Max (Vsup)
|
1.35 V
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Supply Voltage-Min (Vsup)
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1.15 V
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Supply Voltage-Nom (Vsup)
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1.2 V
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Surface Mount
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YES
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Technology
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CMOS
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Terminal Form
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BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Width
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14 mm
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