Part Details for GS81314LQ19GK-933I by GSI Technology
Overview of GS81314LQ19GK-933I by GSI Technology
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for GS81314LQ19GK-933I
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2364-GS81314LQ19GK-933I-ND
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DigiKey | IC SRAM 144MBIT PAR 260BGA Min Qty: 10 Lead time: 26 Weeks Container: Tray | Temporarily Out of Stock |
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$564.2640 | Buy Now |
DISTI #
GS81314LQ19GK-933I
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Avnet Americas | SRAM Chip Sync Single 1.3V 144Mbit 8M X 18 10ns 260-Pin BGA - Trays (Alt: GS81314LQ19GK-933I) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days Container: Tray | 0 |
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$556.1000 / $684.7500 | Buy Now |
DISTI #
464-81314LQ19GK933I
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Mouser Electronics | SRAM 1.2/1.25V 8M x 18 144M RoHS: Compliant | 0 |
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$547.8000 | Order Now |
DISTI #
GS81314LQ19GK-933I
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Avnet Silica | SRAM Chip Sync Single 1.3V 144Mbit 8M X 18 10ns 260-Pin BGA (Alt: GS81314LQ19GK-933I) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 27 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for GS81314LQ19GK-933I
GS81314LQ19GK-933I CAD Models
GS81314LQ19GK-933I Part Data Attributes
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GS81314LQ19GK-933I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS81314LQ19GK-933I
GSI Technology
DDR SRAM, 8MX18, CMOS, PBGA260, BGA-260
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Package Description | HBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 20 Weeks | |
Samacsys Manufacturer | GSI TECHNOLOGY | |
JESD-30 Code | R-PBGA-B260 | |
Length | 22 mm | |
Memory Density | 150994944 bit | |
Memory IC Type | DDR SRAM | |
Memory Width | 18 | |
Number of Functions | 1 | |
Number of Terminals | 260 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Organization | 8MX18 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 2.3 mm | |
Supply Voltage-Max (Vsup) | 1.35 V | |
Supply Voltage-Min (Vsup) | 1.25 V | |
Supply Voltage-Nom (Vsup) | 1.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm |