Datasheets
GS81314LQ36GK-133I by: GSI Technology

QDR SRAM, 4MX36, CMOS, PBGA260, BGA-260

Part Details for GS81314LQ36GK-133I by GSI Technology

Overview of GS81314LQ36GK-133I by GSI Technology

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Price & Stock for GS81314LQ36GK-133I

Part # Distributor Description Stock Price Buy
DISTI # 2364-GS81314LQ36GK-133I-ND
DigiKey IC SRAM 144MBIT PAR 260BGA Min Qty: 10 Lead time: 26 Weeks Container: Tray Temporarily Out of Stock
  • 10 $561.5450
$561.5450 Buy Now
DISTI # GS81314LQ36GK-133I
Avnet Americas SRAM Chip 144M-bit 4M x 36 1333MHz 260-Pin BGA - Trays (Alt: GS81314LQ36GK-133I) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days Container: Tray 0
  • 84 $681.4500
  • 168 $669.0600
  • 336 $636.0200
  • 504 $619.5000
  • 672 $598.8500
  • 840 $569.9400
  • 8,400 $553.4200
$553.4200 / $681.4500 Buy Now

Part Details for GS81314LQ36GK-133I

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GS81314LQ36GK-133I Part Data Attributes

GS81314LQ36GK-133I GSI Technology
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GS81314LQ36GK-133I GSI Technology QDR SRAM, 4MX36, CMOS, PBGA260, BGA-260
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Package Description HBGA,
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 20 Weeks
JESD-30 Code R-PBGA-B260
Length 22 mm
Memory Density 150994944 bit
Memory IC Type QDR SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 260
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode SYNCHRONOUS
Organization 4MX36
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, HEAT SINK/SLUG
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 2.3 mm
Supply Voltage-Max (Vsup) 1.35 V
Supply Voltage-Min (Vsup) 1.2 V
Supply Voltage-Nom (Vsup) 1.25 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

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