Part Details for GS81314LT36GK-133I by GSI Technology
Overview of GS81314LT36GK-133I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
ISL91133IIPZ-T | Renesas Electronics Corporation | High Efficiency 2.3A Boost Regulator With Input-to-Output Bypass | |
ISL69133IRAZ | Renesas Electronics Corporation | Digital, Dual Output, 4-Phase Configurable, VR13/IMVP8 PWM Controller | |
ISL91133IIO-EVZ | Renesas Electronics Corporation | High Efficiency 2.3A Boost Regulator With Input-to-Output Bypass Evaluation Boards |
Price & Stock for GS81314LT36GK-133I
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2364-GS81314LT36GK-133I-ND
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DigiKey | IC SRAM 144MBIT PAR 260BGA Min Qty: 10 Lead time: 26 Weeks Container: Tray | Temporarily Out of Stock |
|
$610.1240 | Buy Now |
DISTI #
GS81314LT36GK-133I
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Avnet Americas | SRAM Chip 144M-bit 4M x 36 1333MHz 260-Pin BGA - Trays (Alt: GS81314LT36GK-133I) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days Container: Tray | 0 |
|
$593.6200 / $730.9500 | Buy Now |
Part Details for GS81314LT36GK-133I
GS81314LT36GK-133I CAD Models
GS81314LT36GK-133I Part Data Attributes
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GS81314LT36GK-133I
GSI Technology
Buy Now
Datasheet
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GS81314LT36GK-133I
GSI Technology
DDR SRAM, 4MX36, CMOS, PBGA260, BGA-260
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Package Description | HBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 20 Weeks | |
JESD-30 Code | R-PBGA-B260 | |
Length | 22 mm | |
Memory Density | 150994944 bit | |
Memory IC Type | DDR SRAM | |
Memory Width | 36 | |
Number of Functions | 1 | |
Number of Terminals | 260 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Mode | SYNCHRONOUS | |
Organization | 4MX36 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 2.3 mm | |
Supply Voltage-Max (Vsup) | 1.35 V | |
Supply Voltage-Min (Vsup) | 1.2 V | |
Supply Voltage-Nom (Vsup) | 1.25 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm |