Datasheets
GS81314PQ36GK-125I by: GSI Technology

QDR SRAM, 4MX36, CMOS, PBGA260, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-260

Part Details for GS81314PQ36GK-125I by GSI Technology

Overview of GS81314PQ36GK-125I by GSI Technology

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Price & Stock for GS81314PQ36GK-125I

Part # Distributor Description Stock Price Buy
DISTI # GS81314PQ36GK-125I
Avnet Silica GTEGS81314PQ36GK-125I (Alt: GS81314PQ36GK-125I) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 27 Weeks, 0 Days Silica - 0
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Part Details for GS81314PQ36GK-125I

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GS81314PQ36GK-125I Part Data Attributes:

GS81314PQ36GK-125I GSI Technology
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GS81314PQ36GK-125I GSI Technology QDR SRAM, 4MX36, CMOS, PBGA260, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-260
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Package Description HBGA, BGA260,13X20,40
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Clock Frequency-Max (fCLK) 1250 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B260
Length 22 mm
Memory Density 150994944 bit
Memory IC Type QDR SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 260
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 4MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA260,13X20,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, HEAT SINK/SLUG
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 2.3 mm
Standby Voltage-Min 1.15 V
Supply Voltage-Max (Vsup) 1.3 V
Supply Voltage-Min (Vsup) 1.15 V
Supply Voltage-Nom (Vsup) 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 14 mm

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