Part Details for GS816032DGT-250I by GSI Technology
Overview of GS816032DGT-250I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Electronic Manufacturing
Price & Stock for GS816032DGT-250I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS816032DGT-250I
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Avnet Americas | SRAM Chip Sync Quad 2.5V/3.3V 18M-Bit 512K x 32 5.5ns/2.5ns 100-Pin TQFP - Bulk (Alt: GS816032DGT-250I) RoHS: Compliant Min Qty: 72 Package Multiple: 72 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
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$16.1604 / $19.8990 | Buy Now |
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DISTI #
464-GS816032DGT-250I
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Mouser Electronics | SRAM 2.5 or 3.3V 512K x 32 16M RoHS: Compliant | 18 |
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$16.7400 / $21.9800 | Buy Now |
Part Details for GS816032DGT-250I
GS816032DGT-250I CAD Models
GS816032DGT-250I Part Data Attributes:
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GS816032DGT-250I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS816032DGT-250I
GSI Technology
Cache SRAM, 512KX32, 5.5ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | QFP | |
| Package Description | LQFP, | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| Access Time-Max | 5.5 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | |
| JESD-30 Code | R-PQFP-G100 | |
| Length | 20 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 100 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX32 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LQFP | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |