There are no models available for this part yet.
Overview of GS816118DD-333 by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 2 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 2 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Computing and Data Storage
Agriculture Technology
Price & Stock for GS816118DD-333 by GSI Technology
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
GS816118DD-333
|
Avnet Americas | SRAM Chip Sync Dual 2.5V/3.3V 18M-Bit 1M x 18 4.5ns/2.5ns 165-Pin FBGA - Bulk (Alt: GS816118DD-333) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$23.7180 / $29.2050 | Buy Now | |
DISTI #
464-GS816118DD-333
|
Mouser Electronics | SRAM 2.5 or 3.3V 1M x 18 18M RoHS: Not Compliant | 0 |
|
$25.0100 / $27.9200 | Order Now |
CAD Models for GS816118DD-333 by GSI Technology
Part Data Attributes for GS816118DD-333 by GSI Technology
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
Part Package Code
|
BGA
|
Package Description
|
LBGA,
|
Pin Count
|
165
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.B
|
HTS Code
|
8542.32.00.41
|
Factory Lead Time
|
24 Weeks
|
Access Time-Max
|
4.5 ns
|
Additional Feature
|
FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V
|
JESD-30 Code
|
R-PBGA-B165
|
Length
|
15 mm
|
Memory Density
|
18874368 bit
|
Memory IC Type
|
CACHE SRAM
|
Memory Width
|
18
|
Number of Functions
|
1
|
Number of Terminals
|
165
|
Number of Words
|
1048576 words
|
Number of Words Code
|
1000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
1MX18
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Seated Height-Max
|
1.4 mm
|
Supply Voltage-Max (Vsup)
|
2.7 V
|
Supply Voltage-Min (Vsup)
|
2.3 V
|
Supply Voltage-Nom (Vsup)
|
2.5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
13 mm
|
Alternate Parts for GS816118DD-333
This table gives cross-reference parts and alternative options found for GS816118DD-333. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS816118DD-333, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
GS816118DD-333I | Cache SRAM, 1MX18, 4.5ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | GS816118DD-333 vs GS816118DD-333I |
GS816118DD-333T | Cache SRAM, 1MX18, 4.5ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | GS816118DD-333 vs GS816118DD-333T |