There are no models available for this part yet.
Overview of GS8182T37BGD-333I by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 2 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 3 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
ISL3333IRZ-T7A | Renesas Electronics Corporation | 3.3V, ±15kV ESD Protected, Two Port, Dual Protocol (RS-232/RS-485) Transceivers |
Price & Stock for GS8182T37BGD-333I by GSI Technology
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
GS8182T37BGD-333I
|
Avnet Americas | SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Bulk - Trays (Alt: GS8182T37BGD-333I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Container: Tray | 0 |
|
$18.0900 / $22.2750 | Buy Now |
CAD Models for GS8182T37BGD-333I by GSI Technology
Part Data Attributes for GS8182T37BGD-333I by GSI Technology
|
|
---|---|
Pbfree Code
|
Yes
|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Not Recommended
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
Part Package Code
|
BGA
|
Package Description
|
LBGA, BGA165,11X15,40
|
Pin Count
|
165
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.B
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
0.45 ns
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
Clock Frequency-Max (fCLK)
|
333 MHz
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PBGA-B165
|
JESD-609 Code
|
e1
|
Length
|
15 mm
|
Memory Density
|
18874368 bit
|
Memory IC Type
|
DDR II PLUS SRAM
|
Memory Width
|
36
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Ports
|
1
|
Number of Terminals
|
165
|
Number of Words
|
524288 words
|
Number of Words Code
|
512000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
512KX36
|
Output Characteristics
|
3-STATE
|
Output Enable
|
NO
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Equivalence Code
|
BGA165,11X15,40
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.4 mm
|
Standby Current-Max
|
0.17 A
|
Standby Voltage-Min
|
1.7 V
|
Supply Current-Max
|
0.5 mA
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Width
|
13 mm
|
Alternate Parts for GS8182T37BGD-333I
This table gives cross-reference parts and alternative options found for GS8182T37BGD-333I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8182T37BGD-333I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
GS8182T37BGD-333 | DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8182T37BGD-333I vs GS8182T37BGD-333 |
GS8182T37BD-333 | DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8182T37BGD-333I vs GS8182T37BD-333 |