Datasheets
GS8256436GB-200V by: GSI Technology

Cache SRAM, 8MX36, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119

Part Details for GS8256436GB-200V by GSI Technology

Overview of GS8256436GB-200V by GSI Technology

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Applications Consumer Electronics Energy and Power Systems Renewable Energy

Available Datasheets

Part # Manufacturer Description Datasheet
CS4200V-01L Coilcraft Inc Current Sense Transformer, 35A, ROHS COMPLIANT
ADHV4702-1BCPZ Analog Devices 200V Precision Amplifier
ADHV4702-1BCPZ-R7 Analog Devices 200V Precision Amplifier

Price & Stock for GS8256436GB-200V

Part # Distributor Description Stock Price Buy
DISTI # GS8256436GB-200V
Avnet Americas SRAM Chip 288M-bit 8M x 36 200MHz 119-Pin BGA - Trays (Alt: GS8256436GB-200V) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 24 Weeks, 0 Days Container: Tray 0
  • 84 $437.2500
  • 168 $429.3000
  • 336 $408.1000
  • 504 $397.5000
  • 672 $384.2500
  • 840 $365.7000
  • 8,400 $355.1000
$355.1000 / $437.2500 Buy Now
DISTI # 464-GS8256436GB-200V
Mouser Electronics SRAM 1.8/2.5V 8M x 36 288M RoHS: Compliant 0
  • 10 $354.2500
  • 20 $349.7800
$349.7800 / $354.2500 Order Now

Part Details for GS8256436GB-200V

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GS8256436GB-200V Part Data Attributes

GS8256436GB-200V GSI Technology
Buy Now Datasheet
Compare Parts:
GS8256436GB-200V GSI Technology Cache SRAM, 8MX36, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Samacsys Manufacturer GSI TECHNOLOGY
Additional Feature IT ALSO OPERATES AT 2.3 V TO 2.7 V SUPPLY VOLTAGE
JESD-30 Code R-PBGA-B119
Length 22 mm
Memory Density 301989888 bit
Memory IC Type CACHE SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 119
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 8MX36
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.99 mm
Supply Voltage-Max (Vsup) 2 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

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