Part Details for GS8256436GB-333I by GSI Technology
Overview of GS8256436GB-333I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Energy and Power Systems
Renewable Energy
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
ISL3333IRZ-T7A | Renesas Electronics Corporation | 3.3V, ±15kV ESD Protected, Two Port, Dual Protocol (RS-232/RS-485) Transceivers |
Price & Stock for GS8256436GB-333I
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
GS8256436GB-333I
|
Avnet Americas | SRAM Chip 288M-bit 8M x 36 333MHz 119-Pin BGA - Trays (Alt: GS8256436GB-333I) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
|
$415.4000 / $511.5000 | Buy Now |
DISTI #
464-GS8256436GB-333I
|
Mouser Electronics | SRAM 2.5/3.3V 8M x 36 288M RoHS: Compliant | 0 |
|
$414.8300 | Order Now |
Part Details for GS8256436GB-333I
GS8256436GB-333I CAD Models
GS8256436GB-333I Part Data Attributes
|
GS8256436GB-333I
GSI Technology
Buy Now
Datasheet
|
Compare Parts:
GS8256436GB-333I
GSI Technology
Cache SRAM, 8MX36, CMOS, PBGA119, FPBGA-119
|
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 24 Weeks | |
JESD-30 Code | R-PBGA-B119 | |
Length | 22 mm | |
Memory Density | 301989888 bit | |
Memory IC Type | CACHE SRAM | |
Memory Width | 36 | |
Number of Functions | 1 | |
Number of Terminals | 119 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Organization | 8MX36 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 1.99 mm | |
Supply Voltage-Max (Vsup) | 2.7 V | |
Supply Voltage-Min (Vsup) | 2.3 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm |