Part Details for GS82564Z36GB-250 by GSI Technology
Overview of GS82564Z36GB-250 by GSI Technology
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Electronic Manufacturing
Automotive
Price & Stock for GS82564Z36GB-250
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
GS82564Z36GB-250
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Avnet Americas | SRAM Chip 288M-bit 8M x 36 250MHz 119-Pin BGA - Trays (Alt: GS82564Z36GB-250) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
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$355.1000 / $437.2500 | Buy Now |
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DISTI #
464-GS82564Z36GB-250
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Mouser Electronics | SRAM 2.5/3.3V 8M x 36 288M RoHS: Compliant | 0 |
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$349.7800 / $354.2500 | Order Now |
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DISTI #
GS82564Z36GB-250
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Avnet Silica | (Alt: GS82564Z36GB-250) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 27 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
Part Details for GS82564Z36GB-250
GS82564Z36GB-250 CAD Models
GS82564Z36GB-250 Part Data Attributes
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GS82564Z36GB-250
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS82564Z36GB-250
GSI Technology
SRAM,
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Package Description | , | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| Date Of Intro | 2017-10-10 | |
| Access Time-Max | 5.5 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO REQUIRES 3.3V NOMINAL SUPPLY VOLTAGE | |
| Clock Frequency-Max (fCLK) | 250 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B119 | |
| Length | 22 mm | |
| Memory Density | 301989888 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 8MX36 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA119,7X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Seated Height-Max | 1.99 mm | |
| Standby Current-Max | 0.00021 A | |
| Standby Voltage-Min | 2.3 V | |
| Supply Current-Max | 0.61 mA | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |