There are no models available for this part yet.
Overview of GS82583ED18GK-500I by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Computing and Data Storage
Electronic Manufacturing
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| LT3500IMSE#PBF | Analog Devices | Mono 2A Buck Reg Plus Lin Reg/ | |
| LT8500ITJ#PBF | Analog Devices | 48-Ch LED PWM Gen w/ 12-B Reso | |
| LT3500IMSE#TRPBF | Analog Devices | Mono 2A Buck Reg Plus Lin Reg/ |
Price & Stock for GS82583ED18GK-500I by GSI Technology
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
GS82583ED18GK-500I
|
Avnet Americas | SRAM Chip Sync Single 1.3V 288Mbit 16M X 18 0.4ns 260-Pin FBGA - Trays (Alt: GS82583ED18GK-500I) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
|
$529.3000 / $651.7500 | Buy Now | |
|
DISTI #
464-82583ED18GK500I
|
Mouser Electronics | SRAM 1.2/1.5V 16M x 18 288M RoHS: Compliant | 0 |
|
$529.2700 | Order Now | |
|
DISTI #
GS82583ED18GK-500I
|
Avnet Silica | SRAM Chip Sync Single 1.3V 288Mbit 16M X 18 0.4ns 260-Pin FBGA (Alt: GS82583ED18GK-500I) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 27 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
CAD Models for GS82583ED18GK-500I by GSI Technology
Part Data Attributes for GS82583ED18GK-500I by GSI Technology
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
|
Package Description
|
HBGA,
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.2.B
|
|
HTS Code
|
8542.32.00.41
|
|
Factory Lead Time
|
24 Weeks
|
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JESD-30 Code
|
R-PBGA-B260
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JESD-609 Code
|
e1
|
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Length
|
22 mm
|
|
Memory Density
|
301989888 bit
|
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Memory IC Type
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QDR SRAM
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|
Memory Width
|
18
|
|
Number of Functions
|
1
|
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Number of Terminals
|
260
|
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Number of Words
|
16777216 words
|
|
Number of Words Code
|
16000000
|
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Operating Mode
|
SYNCHRONOUS
|
|
Organization
|
16MX18
|
|
Package Body Material
|
PLASTIC/EPOXY
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|
Package Code
|
HBGA
|
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Package Shape
|
RECTANGULAR
|
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Package Style
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GRID ARRAY, HEAT SINK/SLUG
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|
Parallel/Serial
|
PARALLEL
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|
Seated Height-Max
|
2.3 mm
|
|
Supply Voltage-Max (Vsup)
|
1.25 V
|
|
Supply Voltage-Min (Vsup)
|
1.15 V
|
|
Supply Voltage-Nom (Vsup)
|
1.2 V
|
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Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Terminal Finish
|
TIN SILVER COPPER
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
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Terminal Position
|
BOTTOM
|
|
Width
|
14 mm
|