Part Details for GS832118AGD-250V by GSI Technology
Overview of GS832118AGD-250V by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Entertainment and Gaming
Price & Stock for GS832118AGD-250V
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS832118AGD-250V
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Avnet Americas | SRAM Chip Sync Dual 1.8V/2.5V 36M-Bit 2M x 18 5.5ns/3ns 165-Pin FBGA - Bulk (Alt: GS832118AGD-250V) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
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$52.9032 / $65.1420 | Buy Now |
DISTI #
464-GS832118AGD-250V
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Mouser Electronics | SRAM 1.8/2.5V 2M x 18 36M RoHS: Compliant | 0 |
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$51.8700 / $60.5200 | Order Now |
Part Details for GS832118AGD-250V
GS832118AGD-250V CAD Models
GS832118AGD-250V Part Data Attributes
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GS832118AGD-250V
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS832118AGD-250V
GSI Technology
Cache SRAM, 2MX18, 5.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 24 Weeks | |
Access Time-Max | 5.5 ns | |
Additional Feature | PIPELINE OR FLOW THROUGH ARCHITECTURE; ALSO OPERATES AT 2.5 SUPPLY | |
JESD-30 Code | R-PBGA-B165 | |
Length | 15 mm | |
Memory Density | 37748736 bit | |
Memory IC Type | CACHE SRAM | |
Memory Width | 18 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 2MX18 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 2 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 13 mm |