Part Details for GS832272C-133 by GSI Technology
Overview of GS832272C-133 by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for GS832272C-133
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS832272C-133
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Avnet Americas | SRAM Chip Sync Octal 2.5V/3.3V 36M-Bit 512K x 72-Bit 8.5ns/4ns 209-Pin FBGA Tray - Trays (Alt: GS832272C-133) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
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$64.8828 / $79.8930 | Buy Now |
DISTI #
464-GS832272C-133
|
Mouser Electronics | SRAM 2.5 or 3.3V 512K x 72 36M RoHS: Not Compliant | 0 |
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$67.0300 / $75.9000 | Order Now |
Part Details for GS832272C-133
GS832272C-133 CAD Models
GS832272C-133 Part Data Attributes
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GS832272C-133
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS832272C-133
GSI Technology
Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | LBGA, BGA209,11X19,40 | |
Pin Count | 209 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 24 Weeks | |
Access Time-Max | 8.5 ns | |
Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | |
Clock Frequency-Max (fCLK) | 133 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B209 | |
Length | 22 mm | |
Memory Density | 37748736 bit | |
Memory IC Type | CACHE SRAM | |
Memory Width | 72 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 209 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX72 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA209,11X19,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 220 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.7 mm | |
Standby Current-Max | 0.06 A | |
Standby Voltage-Min | 2.38 V | |
Supply Current-Max | 0.235 mA | |
Supply Voltage-Max (Vsup) | 2.7 V | |
Supply Voltage-Min (Vsup) | 2.3 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 14 mm |
Alternate Parts for GS832272C-133
This table gives cross-reference parts and alternative options found for GS832272C-133. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS832272C-133, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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GS832272GC-133 | Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209 | GSI Technology | GS832272C-133 vs GS832272GC-133 |
GS832272GC-133I | Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209 | GSI Technology | GS832272C-133 vs GS832272GC-133I |