Datasheets
GS832272C-133IV by: GSI Technology

Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209

Part Details for GS832272C-133IV by GSI Technology

Overview of GS832272C-133IV by GSI Technology

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Applications Industrial Automation Renewable Energy Robotics and Drones

Price & Stock for GS832272C-133IV

Part # Distributor Description Stock Price Buy
DISTI # GS832272C-133IV
Avnet Americas SRAM Chip Sync Octal 1.8V/2.5V 36M-Bit 512K x 72-Bit 8.5ns/4ns 209-Pin FBGA Tray - Trays (Alt: GS832272C-133IV) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 24 Weeks, 0 Days Container: Tray 0
  • 84 $102.4650
  • 168 $100.6020
  • 336 $95.6340
  • 504 $93.1500
  • 672 $90.0450
  • 840 $85.6980
  • 8,400 $83.2140
$83.2140 / $102.4650 Buy Now
DISTI # 464-GS832272C-133IV
Mouser Electronics SRAM 1.8/2.5V 512K x 72 36M 0
  • 14 $97.3400
  • 28 $95.2700
$95.2700 / $97.3400 Order Now

Part Details for GS832272C-133IV

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GS832272C-133IV Part Data Attributes

GS832272C-133IV GSI Technology
Buy Now Datasheet
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GS832272C-133IV GSI Technology Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA,
Pin Count 209
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 8.5 ns
Additional Feature FLOW-THROUGH OR PIELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
JESD-30 Code R-PBGA-B209
Length 22 mm
Memory Density 37748736 bit
Memory IC Type CACHE SRAM
Memory Width 72
Number of Functions 1
Number of Terminals 209
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX72
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.7 mm
Supply Voltage-Max (Vsup) 2 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

Alternate Parts for GS832272C-133IV

This table gives cross-reference parts and alternative options found for GS832272C-133IV. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS832272C-133IV, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS832272C-133V Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 GSI Technology GS832272C-133IV vs GS832272C-133V
GS832272C-133IVT Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 GSI Technology GS832272C-133IV vs GS832272C-133IVT
GS832272GC-133V Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209 GSI Technology GS832272C-133IV vs GS832272GC-133V
GS832272C-133VT Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 GSI Technology GS832272C-133IV vs GS832272C-133VT
GS832272GC-133VT Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209 GSI Technology GS832272C-133IV vs GS832272GC-133VT
Part Number Description Manufacturer Compare
CY7C1464AV25-250BGC ZBT SRAM, 512KX72, 2.6ns, CMOS, PBGA209, 14 X 22 MM, 1.76 MM HEIGHT, FBGA-209 Cypress Semiconductor GS832272C-133IV vs CY7C1464AV25-250BGC
GS832472GC-250 Cache SRAM, 512KX72, 6ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 GSI Technology GS832272C-133IV vs GS832472GC-250
GS8322Z72GC-200 ZBT SRAM, 512KX72, 7.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209 GSI Technology GS832272C-133IV vs GS8322Z72GC-200
GS8322Z72C-200I ZBT SRAM, 512KX72, 7.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 GSI Technology GS832272C-133IV vs GS8322Z72C-200I
CY7C1447AV25-133BGXC Cache SRAM, 512KX72, 6.5ns, CMOS, PBGA209, 14 X 22 MM, 1.76 MM HEIGHT, LEAD FREE, FBGA-209 Cypress Semiconductor GS832272C-133IV vs CY7C1447AV25-133BGXC
GS832272C-200V Cache SRAM, 512KX72, 7.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 GSI Technology GS832272C-133IV vs GS832272C-200V
GS832472C-200T Cache SRAM, 512KX72, 7.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 GSI Technology GS832272C-133IV vs GS832472C-200T
GS832272GC-166T Cache SRAM, 512KX72, 8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209 GSI Technology GS832272C-133IV vs GS832272GC-166T
GS8322Z72C-166IVT ZBT SRAM, 512KX72, 8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 GSI Technology GS832272C-133IV vs GS8322Z72C-166IVT
GS832272GC-150I Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209 GSI Technology GS832272C-133IV vs GS832272GC-150I

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