Part Details for GS832272C-166IV by GSI Technology
Overview of GS832272C-166IV by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for GS832272C-166IV
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS832272C-166IV
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Avnet Americas | SRAM Chip Sync Octal 1.8V/2.5V 36M-Bit 512K x 72-Bit 8ns/3.5ns 209-Pin FBGA Tray - Trays (Alt: GS832272C-166IV) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
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$83.2140 / $102.4650 | Buy Now |
DISTI #
464-GS832272C-166IV
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Mouser Electronics | SRAM 1.8/2.5V 512K x 72 36M | 0 |
|
$95.2700 / $97.3400 | Order Now |
Part Details for GS832272C-166IV
GS832272C-166IV CAD Models
GS832272C-166IV Part Data Attributes
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GS832272C-166IV
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS832272C-166IV
GSI Technology
Cache SRAM, 512KX72, 8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 209 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 24 Weeks | |
Access Time-Max | 8 ns | |
Additional Feature | FLOW-THROUGH OR PIELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | |
JESD-30 Code | R-PBGA-B209 | |
Length | 22 mm | |
Memory Density | 37748736 bit | |
Memory IC Type | CACHE SRAM | |
Memory Width | 72 | |
Number of Functions | 1 | |
Number of Terminals | 209 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512KX72 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.7 mm | |
Supply Voltage-Max (Vsup) | 2 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm |
Alternate Parts for GS832272C-166IV
This table gives cross-reference parts and alternative options found for GS832272C-166IV. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS832272C-166IV, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
GS832272GC-166VT | Cache SRAM, 512KX72, 8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209 | GSI Technology | GS832272C-166IV vs GS832272GC-166VT |
GS832272GC-166IVT | Cache SRAM, 512KX72, 8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209 | GSI Technology | GS832272C-166IV vs GS832272GC-166IVT |
GS832272C-166IVT | Cache SRAM, 512KX72, 8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS832272C-166IV vs GS832272C-166IVT |
GS832272C-166V | Cache SRAM, 512KX72, 8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS832272C-166IV vs GS832272C-166V |